Millimeter wave module with an interconnect from an interior cav

Details Millimeter wave module with an interconnect from an interior cav Millimeter wave module with an interconnect from an interior cav

1998-07-31

2000-05-16

Bettendorf, Justin P.

Wave transmission lines and networks

Long line elements and components

Strip type

3332191, 257728, 361760, H01P 500

Patent

active

060642866

ABSTRACT:
A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).

REFERENCES:
patent: 3629787 (1971-12-01), Wilson
patent: 3729820 (1973-05-01), Ihochi et al.
patent: 4530002 (1985-07-01), Kanai
patent: 4631820 (1986-12-01), Harada et al.
patent: 5208188 (1993-05-01), Newman
patent: 5223739 (1993-06-01), Katsumata et al.
patent: 5235300 (1993-08-01), Chan et al.
patent: 5266746 (1993-11-01), Nishihara et al.
patent: 5294897 (1994-03-01), Notani et al.
patent: 5343074 (1994-08-01), Higgins, III et al.
patent: 5363075 (1994-11-01), Fanucchi
patent: 5378657 (1995-01-01), Lin
patent: 5409865 (1995-04-01), Karnezos
patent: 5420460 (1995-05-01), Massangill
patent: 5426319 (1995-06-01), Notani
patent: 5455453 (1995-10-01), Harada et al.
patent: 5482898 (1996-01-01), Marrs
patent: 5556807 (1996-09-01), Bhattacharyya et al.
patent: 5752851 (1998-05-01), Zaderej et al.
patent: 5770300 (1998-06-01), Okamoto et al.
patent: 5821615 (1998-10-01), Lee
patent: 5847453 (1998-12-01), Uematsu et al.
Advnced packaging: by Bernie Ziegner; May/Jun. 1996; Life Over 30 GHZ-Ploymer-Based packages Revolutionized RF/MW Designs; pp. 46-48.
Microelectronics packaging Handbook; 1989 by Van Nostrand Reinhold; Chapter 6, Chip-To-Package interconnections, Nicholas G. Koopman, Timothy C. Reiley, Paul A. Totta.
ISHM '95 Proceedings; A New Leadframless IC Carrier package Using Metal Base Substrate; Abastract, pp. 348-353, 1995.

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