Solid-state imaging device and manufacturing method thereof

Details Solid-state imaging device and manufacturing method thereof Solid-state imaging device and manufacturing method thereof

2011-03-01

2011-03-01

Shingleton, Michael B (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S685000, C257S693000, C257S433000, C348S076000

Reexamination Certificate

active

07898085

ABSTRACT:
A solid-state imaging device comprises a solid-state imaging element including a photo-reception portion and electrode pads, and optical glass bonded onto the solid-state imaging element through a bonding layer, wherein penetrating electrodes which reach the rear face of the solid-state imaging element are formed below the electrode pads of the solid-state imaging element.

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Shweky, A. Badihi, “A CSP Optoelectronic Package for Imaging and Light Detection Applications”, Proceedings of the SPIE, Jan. 1, 1999, pp. 63-68, vol. 3650.

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