Method and structure to reduce cracking in flip chip underfill

Details Method and structure to reduce cracking in flip chip underfill Method and structure to reduce cracking in flip chip underfill

2011-04-05

2011-04-05

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S112000, C438S118000, C438S127000

Reexamination Certificate

active

07919356

ABSTRACT:
A method of assembling a microelectronic flip-chip arrangement includes attaching a chip having a defined length to a supporting substrate, wherein the chip forms a chip shadow line of the defined length on the supporting substrate, creating a first non-wettable zone on an outer portion of the bottom surface of the chip, creating a second non-wettable zone on a portion of the supporting substrate outside the chip shadow line, underfilling the chip and forming a fillet, wherein the fillet does not extend beyond the chip shadow line, and hardening the underfill including the fillet.

REFERENCES:
patent: 6372511 (2002-04-01), Silver et al.
patent: 6794225 (2004-09-01), Manepalli et al.
patent: 6984286 (2006-01-01), Bonitz et al.
patent: 2007/0099346 (2007-05-01), Farooq et al.

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