Elastic plate structure for preventing electromagnetic...

Metal working – Method of mechanical manufacture – Assembling or joining

Reexamination Certificate

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Details

C361S816000, C361S818000, C174S034000, C029S885000

Reexamination Certificate

active

06305067

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to an elastic plate for preventing electromagnetic interference and manufacturing method for the same, more particularly, to an elastic plate to shield microprocessor and memory on motherboard of computer from electromagnetic interference and manufacturing method for the same.
BACKGROUND OF THE INVENTION
The conventional means to prevent electromagnetic interference (EMI) involves conductive sponge placed on the peripheral of the microprocessor and the memory of computer and attached to a hollow housing, thus providing EMI shielding for the microprocessor and the memory.
However, the conductive sponge is arranged manually, the process is cumbersome and the cost is high.
It is the object of the present invention to provide an elastic plate structure for preventing electromagnetic interference, which has automatic manufacture process with low cost.
To achieve the above object, the elastic plate according to the present invention uses thermally-treated Be—Cu (beryllium-copper) plate as base material, and the Be—Cu plate is electroplated and punched to form an elastic plate structure for preventing electromagnetic interference.
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing, in which:


REFERENCES:
patent: 2206662 (1940-07-01), Conradi et al.
patent: 5193271 (1993-03-01), Kato
patent: 5225629 (1993-07-01), Garrett
patent: 5307562 (1994-05-01), Denlinger et al.
patent: 6005186 (1999-12-01), Bachman
patent: 56167272-A (1981-12-01), None
Archambeault et al., Effects of corrosion on the electrical properties of conducted finishes for EMI shielding 1989, IEEE, 1989 National Symposium on Electromagnetic Compatability, p. 46-51.

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