Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate
2001-01-12
2001-10-23
Paumen, Gary (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate
active
06305950
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of Invention
The present invention relates generally to modular communication connectors and more particularly to a modular communication connector having an improved contact arrangement designed to meet the increasing performance requirements of the communications industry in conjunction with increased data transfer rates.
2. Description of Related Art
In the communications industry, as data transmission rates have steadily increased, the industry has strived to provide electrical communication connectors that meet the needs to carry relatively high frequency signals while maintaining mechanical strength requirements and manufacturability. A wide variety of improvements have been made in the design of electrical connectors to reduce crosswalk effect occurring in parallel runs of closely spaced adjacent connectors. One example is co-pending U.S. Ser. No. 09/138,969 filed Aug. 24, 1998, which is commonly assigned to Panduit Corporation and incorporated herein by reference in its entirety. This type of connector uses a particular conductor configuration in conjunction with a multi-layered printed circuit board containing capacitors to achieve a reduction in the crosstalk effect. However, due to the high level of crosstalk occurring at the contact interface area for this connector at very high rates, the tuning effect achievable by the capacitors can still be difficult to accomplish. As such, further improvements in the art are still needed to address such problems and achieve higher levels of crosstalk suppression.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a modular communication connector with improved crosstalk performance.
It is another object of the present invention to provide an electrical communications connector having an improved contact design to reduce the effect of electrical crosstalk.
In general, a modular communications connector according to the invention includes a housing defining a plug receiving opening, a conductor carrying sled supporting first and second pluralities of conductors, and a wire containment fixture for terminating a communication cable having a plurality of individual communication wires. The first plurality of conductors includes first and second subsets of resilient contacts forming eight laterally spaced first conductors arranged in a telephone plug mating configuration. The first conductors may be associated with corresponding second conductors, preferably formed as insulation displacement contact (IDC) portions disposed extending rearwardly in a direction generally parallel to an axis of entry of the plug receiving opening. The IDC portions of the conductors are provided to terminate wire pairs of the communication cable and can be suitably arranged in upper and lower rows of four IDC portions. The connector also preferably uses a printed circuit board design incorporating capacitors which in conjunction with the conductor design improves the overall crosstalk performance.
The first subset of contacts are connected to the printed circuit board at first ends, extend from a bottom side of the printed circuit board towards and bend around a front end of the printed circuit board, and have second ends extending above the top surface of the printed circuit board to form plug contacting portions that are disposed within the plug receiving opening of the connector. The second subset of contacts are connected to the printed circuit board at first ends, extend from the top side of the printed circuit board toward the front end of the printed circuit board and then include a reverse bend ending in second ends that form plug contacting portions that extend above the top surface of the printed circuit board and are disposed within the plug receiving opening of the connector.
In a preferred embodiment, the second ends of the second subset of contacts extend in a generally parallel plane to the second ends of the first subset of contacts. By modifying the contacts in the jack/plug contact interface, the parallel runs of adjacent contacts in the communications connector can have improved crosstalk performance (i.e., reduced crosstalk between adjacent runs). In a firther preferred embodiment, the eight contacts are configured with the standard left to right numbering of contacts
1
-
8
. These contacts are further arranged in two staggered rows, with contacts
2
,
4
and
6
forming the second subset and all three being located in a rearward one of the two staggered rows. Contacts
1
,
3
,
5
and
7
-
8
form the first subset of contacts. Preferably, contact
8
is also provided in the rearward staggered row.
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McCann Robert A.
Nguyen Phuong
Panduit Corp.
Paumen Gary
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