Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-04-02
2001-11-27
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S689000, C312S223200
Reexamination Certificate
active
06324062
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to packaging configurations for computer systems and, more particularly, to a packaging configuration for a computer system that can operate multiple operating systems in different partitions on the computer system and that can allow the different partitions to communicate with one another through shared memory.
A computer system typically includes a processor, main memory, and input/output (I/O) devices (e.g., printers, network interfaces, graphic display interfaces). The computer system uses an addressing scheme to designate the source or destination of an item of data. Memory management functions, including the accessing of data, as well as other management functions, are controlled at least in part by an operating system. There are a variety of operating systems on the market, each having their own unique characteristics and capabilities. Conventional computer systems typically employ a single operating system.
As modern computer systems grow, and the demands of the computer user increases, the necessity of employing a plurality of operating systems increases. A plurality of operating systems, however, substantially increases the complexity of the computer system.
In order to meet the demands of the computer user by employing a plurality of operating systems, a computer system has been discovered that can allow multiple operating systems, including different operating systems, to operate in different partitions on the computer system. The computer system can be adapted to allow the different partitions, including the operating systems and other clients running in the different partitions, to communicate with one another through a shared memory. Needed in connection with such a computer system is a packaging configuration that is well adapted to contain a partitionable computer system.
SUMMARY OF THE INVENTION
In order to provide a packaging configuration that is well adapted to house a partitionable computer system, a modular configuration has been discovered. According to one aspect of this invention, a method is provided for use in a computer system having processing modules and operating systems with a shared memory that is housed in a chassis. The method includes providing a removable pod and receiving the pod within the chassis and coupling the pod to the shared memory. A removable sub-pod is provided having a processing module and the sub-pod is received within the pod and coupled to the pod. The method also includes configuring groups of at least one sub-pod as separate partitions within the computer system and assigning each of the separate partitions to a separate operating system. Program code is provided for executing on the separate partitions and enabling the communication of the separate partitions with each other through the shared memory. The method includes the step of removing the at least one sub-pod of a group from a pod and thereby disabling the separate partition under which the removed sub-pod group operates without interrupting the execution of the program code on the remaining at least one separate partition. A corresponding computer system is also provided.
According to another aspect of this invention, a processor subassembly or “sub-pod” is provided with a chassis at least partially defining an interior and an opening for access to the interior. The chassis includes a support and a circuit board mounted to the chassis and positioned at least partially within the interior of the chassis. A processor is provided within the interior of the chassis, and the processor is releasably connected to the circuit board, wherein the processor is positioned adjacent to the support and has an edge portion in contact with the support. The chassis is configured for insertion into and removal from a computer system chassis to facilitate releasable interconnection between the circuit board of the sub-pod and a circuit board of the computer system.
According to another aspect of this invention, a processor assembly or “pod” is provided with a configuration for releasable connection within a computer system. The pod includes a chassis at least partially defining an interior and an opening for access to the interior. The pod also includes a circuit board mounted to the chassis and positioned within the interior of the chassis, wherein the circuit board includes a connector. Also included in the pod is a sub-pod that is configured for releasable connection within the interior of the pod's chassis. The sub-pod's chassis has a cross-sectional shape perpendicular to the insertion axis corresponding substantially to the shape of the pod's opening, thereby promoting alignment and proper interconnection of the sub-pod's connector and the pod's circuit board as the sub-pod is inserted.
According to another aspect of this invention, a chassis assembly for a pod is provided that is configured for releasable connection within a computer system and is configured to receive a sub-pod. The chassis assembly includes a chassis at least partially defining an interior and an opening for access to the interior. The chassis assembly also includes a circuit board mounted at least partially within the interior of the chassis in juxtaposition with the opening of the chassis. The circuit board includes a connector for connection to a computer system's circuit board as well as a connector for connection to a sub-pod circuit board. The chassis is configured for sliding insertion into an opening of a computer system's chassis for connection between a connector and a computer system circuit board. The chassis is also configured to receive in the opening a sub-pod for connection between a connector and a sub-pod circuit board.
According to another aspect of this invention, a packaging configuration for a computer system is provided with a main chassis defining an opening and an interior and having a main circuit board such as a midplane mounted in juxtaposition with the interior. The packaging configuration also includes a pod having a chassis configured for sliding insertion into the interior of the main chassis for making interconnection between the pod's circuit board and the main circuit board upon sliding insertion of the pod's chassis into the interior of the main chassis. The packaging configuration also includes a sub-pod having a chassis configured for sliding insertion into an opening in the chassis of the pod. The sub-pod is configured for making interconnection between a circuit board in the sub-pod and the circuit board of the pod upon sliding insertion into the interior of the pod.
According to another aspect of this invention, a modular computer system includes a chassis containing a memory storage unit mounted within an interior of the chassis. The modular computer system also includes a pod configured for insertion into the chassis, wherein the pod includes an electronic switch for connection to the memory storage unit in the chassis. The modular computer system also includes sub-pods configured for insertion into the pod, wherein each of the sub-pods includes a processor and cache memory connected to the processor. Each of the sub-pods being connected to the switch in the pod upon insertion, and each of the sub-pods being separately removable from the pod for disconnection from the switch without powering down the computer system. The pod is also removable from the interior of the chassis for disconnection from the memory storage unit without powering down the computer system.
According to yet another aspect of this invention, the sub-pod includes a chassis, a circuit board, and a processor mounted within the interior of the chassis. The sub-pod includes a cover that is configured for releasable engagement to the chassis. The cover is positioned adjacent to the processor and includes an integral spring portion positioned for contact with the processor. The integral spring portion is configured to apply a compressive force against the processor, thereby urging the process
Klein Peter P.
Newman N. Kenneth
Smith Grant M.
Treiber Mark R.
Lea-Edmonds Lisa
Picard Leo P.
Unisys Corporation
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