Laser soldering of flexible leads

Details Laser soldering of flexible leads Laser soldering of flexible leads

1990-10-01

1991-10-08

Albritton, C. L.

Electric heating

Metal heating

By arc

B23K 2600

Patent

active

050556525

ABSTRACT:
A method for soldering a lead to a pad having a solder plate formed thereon is described. In one embodiment of the method, a tape is disposed between the lead and a laser source, and the method includes the steps of aligning the lead with the solder plated pad, transmitting a beam from the laser source through the tape and to a location where a solder joint is to be formed, and the beam heating the solder plate thereby causing reflow of the solder plate to form a solder joint.

REFERENCES:
patent: 4564736 (1986-01-01), Jones et al.
patent: 4681396 (1987-07-01), Jones
patent: 4799755 (1989-01-01), Jones
patent: 4877175 (1989-10-01), Jones et al.
patent: 4978835 (1990-12-01), Luijtjes et al.
Lea, "A Scientific Guide to Surface Mount Technology", Electrochemical Publications Limited, 1988 (pp. 20-22).
"Microelectronics Packaging Handbook", edited by Tummala et al., Van Nostrand Reinhold, 1989 (pp. 409-435).

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