Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-12-10
2001-10-30
Sircus, Brian (Department: 2839)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C439S360000, C439S327000
Reexamination Certificate
active
06310779
ABSTRACT:
FIELD OF INVENTION
The present invention relates to a system attaching cartridge-type CPU to a motherboard of a computer system.
BACKGROUND OF THE INVENTION
CPU is the core component of a computer. Due to improvement of semiconductor production processes, the function and process speed of CPU progresses tremendously. On the other hand, with more functions built within the CPU, increase with respect to the weight and size of CPU has been observed. Using products of Intel® as an example, from the early 486 CPU to Pentium CPU, the products shipped out were packaged in single chip form. Depending on the choice of socket
5
or socket
7
architecture, the CPU is attached to the motherboard through a socket. Hence, under this arrangement, regardless of whether the motherboard is disposed vertically or horizontally in the computer casing, the weight of the CPU usually puts no loading on the motherboard.
Intel® unveiled, in close succession, new types of CPU, such as Pentium II. It is known, instead of the conventional chip BGA packaging approach, Pentium II architecture uses a print circuit board (PCB) to integrate the CPU and the required cache memory. At the same time, side edge contact cartridge (SECC) type packaging is employed to render a cartridge-type Pentium II (CPU). The cartridge-type CPU then copes with SLOT-
1
architecture on the motherboard to constitute the computer system. It is observed that the cartridge-type CPU results in the increase of the weight and size of the CPU module. Therefore, one conventional approach, as shown in
FIG. 1
, employs an insertion frame
12
which is affixed to the motherboard
11
. The insertion frame
12
provides a slot for receiving the cartridge-type CPU
13
. As the motherboard
11
is disposed horizontally within the computer casing, this arrangement will not create too much loading to the motherboard
11
.
Yet to consider the problem of heat dissipation inside the computer casing, most computer casings nowadays are designed to be disposed vertically. As such, the motherboard inside is placed vertically within the casing and the forced air convection approach is applied to improve the cooling ability. However, while the motherboard is disposed vertically, the motherboard must be capable of carrying weight of the cartridge-type CPU which is disposed vertically to the motherboard. If it is not well designed, the motherboard may experience damage due to the weight of the cartridge-type CPU Intel® company recently puts a more powerful cartridge-type CPU, i.e. Xeon, into the market. In addition to using a super-sized SECC, it is larger in size and weight compared with Pentium 11. Furthermore, based on the functions of Xeon, a multi-processor computer system may include two or four Xeon CPUs on a motherboard to enhance the parallel processing capability of the computer system. It is quite clear that, when several super-sized cartridge-type CPUs are simultaneously attached to a motherboard, there must be a suitable CPU attachment system to take care of the loading over the motherboard exerted by the cartridge-type CPUs.
As illustrated in
FIG. 2
, one conventional approach employs at least one vertically-disposed fixation stripe
22
which is attached to the computer casing
21
.
The fixation stripe
22
presses against the edge of cartridge-type CPU
23
tightly so that part of the weight of cartridge-type CPU
23
is transferred to casing
21
via the fixation stripe
22
. Under this approach, the casing
21
requires a corresponding structure to connect the fixation stripe
22
. And this corresponding structure on the casing
21
varies as size or shape of the fixation stripe
22
changes.
SUMMARY OF INVENTION
In light of the above concerns, main objective of the invention is to bring about a system and method for attaching the cartridge-type CPU so that the cartridge-type CPU is precisely attached onto the motherboard without taking too much weight of the cartridge-type CPU.
The system provided attaches a cartridge-type central processor unit (CPU) to a motherboard and includes a first device, a second device and a third device.
The first device has a slot for receiving the cartridge-type CPU. The second device is disposed below the motherboard to fortify the strength of the motherboard. The third device functions to attach the first device and the motherboard to the second device. The weight of the cartridge-type CPU, via the first device and the third device, is substantially transferred to the second device with the second device being a primary carrier of weight of the cartridge-type CPU.
The attachment system doesn't interact with the computer casing, thus avoiding the compatibility issue between different motherboards and different computer casings.
REFERENCES:
patent: 3790051 (1974-02-01), Moore
patent: 3829741 (1974-08-01), Athey
patent: 5737189 (1998-04-01), Kammersgard et al.
patent: 5810613 (1998-09-01), Ati et al.
patent: 6007357 (1999-12-01), Perino et al.
Asustek Computer Inc.
Coudert Brothers
Prasad Chaudrika
Sircus Brian
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