Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
Reexamination Certificate
1999-12-22
2001-11-06
Abrams, Neil (Department: 2839)
Electrical connectors
With insulation other than conductor sheath
Plural-contact coupling part
C439S941000
Reexamination Certificate
active
06312290
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to electrical connectors and more particularly to insulation displacement contact (IDC) modular jacks.
2. Brief Description of Prior Developments
Modular jacks are used in two broad categories of signal transmission: analog (voice) and digital (data) transmission. These categories can overlap somewhat since digital systems are used for voice transmission as well. Nevertheless, there is a significant difference in the amount of data transmitted by a system per second. A low speed system would ordinarily transmit from about 10 to 16 megabytes per second (Mbps), while a high speed system should be able to handle 144 Mbps or even higher data transfer speeds. Often, high speed installations are based on asynchronous transfer mode transmission and utilize shielded and unshielded twisted pair cables.
With recent increases in the speed of data transmission, requirements have become important for electrical connectors, in particular, with regard to the reduction or elimination of crosstalk. Crosstalk is a phenomena in which a part of the electromagnetic energy transmitted through one of multiple conductors in a connector causes electrical currents in the other conductors.
Another factor which must be considered is that the telecommunications industry has reached a high degree of standardization in modular jack design. Outlines and contact areas are essentially fixed and have to be interchangeable with other designs. It is, therefore, important that any novel modular jack allow with only minor modification, the use of conventional parts and tooling in its production and use.
There is, therefore, a need for a modular jack insert which will reduce or eliminate crosstalk in telecommunications equipment.
There is also a need for such a modular jack insert which can reduce or eliminate crosstalk and common mode interference which is interchangeable with prior art modular jacks and which may be manufactured using conventional parts and tooling.
SUMMARY OF THE INVENTION
A high speed IDC modular jack wherein wires are grouped into a first group and a second group and wherein the wires in the first group are longer then the wires in the second group and are in a separate plane from said wires in the second group such that cross talk is reduced. Also encompassed by the present invention is an insert for a modular jack which includes an insulative member having a base section having a first and second end and an angular section extending approximately perpendicularly from the base section. A first conductor extends in a first plane perpendicularly into this base section adjacent its first end. It then extends longitudinally through the base section and then extends perpendicularly into the angular section in a second plane. A second conductor extends in the first plane perpendicularly into the base section and then extends longitudinally through the base section and then extends perpendicularly into the angular section in a third plane. A third conductor extends in a fourth plane perpendicularly into the base section adjacent its second end and then extends into the angular section of the insulative member in the second plane. Preferably a fourth conductor also extends in the fourth plane perpendicularly into the angular section of the insulative member in the third plane.
REFERENCES:
patent: 4533199 (1985-08-01), Feldberg
patent: 5586914 (1996-12-01), Foster, Jr. et al.
patent: 5599209 (1997-02-01), Belopolsky
patent: 5639266 (1997-06-01), Patel
patent: 5779503 (1998-07-01), Tremblay et al.
patent: 5938479 (1999-08-01), Paulson et al.
patent: 5941734 (1999-08-01), Ikeda et al.
Abrams Neil
Dinh Phuong K T
FCI Americas Technology Inc.
Page M. Richard
Reiss Steven M.
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