Water-rinsable soldering fluid containing a polyamide dispersant

Metal treatment – Compositions – Fluxing

Patent

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Details

B23K 3534

Patent

active

041405544

ABSTRACT:
Disclosed is a water-rinsable soldering fluid comprising a mixture of a polyalkylene ether and a polyamide. The polyamide is formed from the reaction of a carboxylic acid and a polyalkylene polyamine.

REFERENCES:
patent: 3527625 (1970-09-01), Mollring
patent: 3589952 (1971-06-01), Burne
patent: 3655461 (1972-04-01), Miwa
patent: 3814638 (1974-06-01), Jordan
patent: 3832242 (1974-08-01), Cuthbert
patent: 3837932 (1974-09-01), Aronberg
patent: 3985587 (1976-10-01), Choby
patent: 4060191 (1977-11-01), Choby

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