Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...
Reexamination Certificate
1999-04-27
2001-02-27
Bell, Mark L. (Department: 1755)
Compositions: ceramic
Ceramic compositions
Glass compositions, compositions containing glass other than...
C501S045000, C501S046000, C501S048000
Reexamination Certificate
active
06194333
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a PDP (plasma display panel) More particularly the present invention relates to dielectric composition and method for forming the composition, such composition used for mading a dielectric layer or a barrier rib of the PDP.
2. Description of the Prior Art
PDP has been considered the most suitable large size FPD (flat panel display) since the process making the PDP panel is easier than any other FPD.
FIG. 1
shows a structure of the PDP cell arranged in a matrix pattern in the conventional AC type PDP. The PDP discharge cell includes an upper plate having a sustaining electrode pair
12
A and
12
B, an upper dielectric layer
14
and a protective layer
16
that are sequentially formed on an upper substrate
10
, and a lower plate having an address electrode
20
, a lower dielectric layer
22
, an barrier rib
24
and phospher
26
that are sequentially formed on a lower substrate
30
. The upper substrate
10
and the lower substrate
18
are facing each other and a discharge cell is defined by these substrates and the barrier ribs
24
. One of the sustain eletrode pair
12
A,
12
B is also used for a scan eletrode applying scan pulses for scanning the panel. The upper dielectric layer
14
is accumulating an electric charge. The protective lyaer
16
prevents the upper dielectric layer
14
from demaging by sputtering so that it may increase a life of PDP and improve an emission efficiency. Mgo is uaually used for the protective layer
16
. The upper and lower substrates
10
and
18
are aligned so that the address eletrode
20
is cross to the sustain electrodes
12
A,
12
B. Data signals are applied to the address electrode
20
in order to select the cell which is to be displayed. The barrier rib
24
prevents the adjacent cells from leaking ultraviolet rays produced by the electrical discharge. The phosphor is coated on the lower dielectric layer
22
ane the barrier ribs
24
so as to genarate red, green or blue visible ray.
The PDP discharge cell having a structure as described above maintains a discharge by a face discharge between the sustaining electrode pair
12
A and
12
B after being selected by an opposite discharge between the address electrode
20
and the scanning/sustaining electrode
12
A. In the PDP discharge cell, the fluorescent body
26
is radiated by an ultraviolet ray generated during the sustained discharge, thereby emitting a visible light to the outer side of the discharge cell. As a result, the PDP having discharge cells display a picture.
FIG. 2
explains a process of manufacturing the barrier rib
24
shown in
FIG. 1
step by step. Referring to
FIG. 2
, in step S
2
, parent glass powder and oxide filler powder, which are materials of the barrier rib, are mixed to prepare mixture powder. In this case, fine powder of less than 100 &mgr;m is made after the parent glass powder and the oxide filler powder are mixed at a predetermined ration. Next, in step S
4
, a paste state to be used for the screen printing method or a slurry state to be used for the tape casting method is made by mixing the mixture powder with an organic vehicle. In step S
6
, by making use of the paste or the slurry, the barrier rib
24
is formed on the lower dielectric layer
22
defined on the lower substrate
18
. In this case, the barrier rib
24
is made by the screen printing method, the sand blast method, the etching method, the additive method, the stamping method and so on. This will be described in detail later. Subsequently, in step S
8
, the barrier rib
24
formed in the step S
6
is dried for 15 to 20 minutes at a temperature range of 300° C. to 500° C. to remove the organic vehicle and thereafter is sintered at a temperature range of 550° C. to 600° C., to thereby complete the barrier rib
24
.
FIG. 3
a
to
FIG. 3
d
are sectional views for representing a process of manufacturing the barrier rib making use of the screen printing method. Referring now to
FIG. 3
a
, there is shown a structure in which the lower dielectric layer
22
and the glass paste patterns
28
are disposed on the lower substrate
18
. The glass paste patterns
28
are formed by coating a glass paste prepared by mixing the glass powder, which is mixed by the parent glass and the filler, with the organic vehicle on the lower dielectric layer
22
at a desired thickness using the screen printing method and thereafter by drying the same during a desired time. Then, a process of forming the glass paste patterns
28
as mentioned above is repeatedly performed about seven to eight times as shown in
FIG. 3
b
and
FIG. 3
c
. As a result, the glass paste patterns
28
are disposed at a desired height, for example, a height of 150 to 200 &mgr;m. The glass paste patterns disposed in this manner are sintered to provide the barrier ribs
24
having a desired height on the lower dielectric layer
22
as shown in
FIG. 3
d.
FIG. 4
a
to
FIG. 4
f
are sectional views for representing a process of manufacturing the barrier rib making use of the sand blast method. After a glass paste
30
is coated on the lower dielectric layer
22
formed on the lower substrate
18
as shown in
FIG. 4
a
, a photo resistor
32
is coated on the glass paste
30
as shown in
FIG. 4
b
. Next, as shown in
FIG. 4
c
, mask patterns
34
are positioned on the photo resistor
32
which is exposed to a light through openings of the mask patterns
34
in turn. Subsequently, after the mask patterns
34
are removed, an non-exposed portion of the photo resistor
32
is removed to form photo resistor patterns
32
A as shown in FIG.
4
D. Then, glass paste patterns
30
A are formed in the same shape as the photo resister patterns
32
A as shown in
FIG. 4E
by removing the exposed glass paste
30
through the photo resistor patterns
32
A using the sand blast method. Consequently, the barrier ribs
24
are provided on the lower dielectric layer
22
as shown in
FIG. 4
f
by sintering the glass paste patterns
30
A after removing the photo resistor patterns
32
A.
FIG. 5
a
to
FIG. 5
c
are sectional views for representing a process of manufacturing the barrier rib making use of the etching method. As shown in
FIG. 5
a
, a paste
34
sensitive to a light is coated on the dielectric layer
22
disposed on the lower substrate
18
. Then, as shown in
FIG. 5
b
, mask patterns
36
are positioned on the sensitive paste
34
which is exposed to a light through the mask patterns
36
. Consequently, the barrier ribs
24
are made as shown in
FIG. 4
c
by removing the mask patterns
36
and then etching a non-exposed portion of the sensitive paste
34
and thereafter by sintering the non-etched portion of the sensitive paste
34
.
FIG. 6
a
to
FIG. 6
e
are sectional views for representing a process of manufacturing the barrier rib making use of the additive method. As shown in
FIG. 6
a
, a photo resistor
38
is coated on the lower dielectric layer
22
disposed on the lower substrate
18
. Then, as shown in
FIG. 6
b
, mask patterns
40
are positioned on the photo resistor
38
which is exposed to a light through the mask patterns
40
. Subsequently, the mask patterns
40
are removed and then the exposed portion of the photo resistor
38
is removed to thereby form photo resistor patterns
38
A as shown in
FIG. 6
c
. Next, as shown in
FIG. 6
d
, glass pastes
30
are coated between the photo resistor patterns
38
A and then dried. Consequently, the barrier ribs
24
are provided on the lower dielectric layer
22
as shown in
FIG. 6
e
by removing the photo resistor patterns
38
A and thereafter by sintering the glass paste
30
.
FIG. 7
a
to
FIG. 7
d
are sectional views for representing a process of manufacturing the barrier rib making use of the stamping method. As shown in
FIG. 7
a
, a glass paste
42
is coated on the lower dielectric layer
22
disposed on the lower substrate
18
. Then, as shown in
FIG. 7
b
, a mold
44
with holes for the barrier ribs is positioned on the glass paste
42
which is stamped by applying a desired pressure t
Bell Mark L.
Fleshner & Kim LLP
LG Electronics Inc.
Sample David
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