Heat sink

Details Heat sink Heat sink

2000-06-27

2001-12-18

Yeung, James C. (Department: 3743)

Heat exchange

Heat transmitter

C165S080300, C361S697000, C361S704000, C361S709000, C174S016300, C257S722000

Reexamination Certificate

active

06330908

ABSTRACT:

BACKGROUND
1. Field of the Invention
The present invention relates to a heat sink, and particularly to a heat sink which reduces resistance to air flowing therethrough.
2. The Related Art
An electronic device, such as a Central Processing Unit (CPU), generates a large amount of heat during operation. Unless the heat is efficiently dissipated, operating stability of the device will be diminished. To assure stable operation, a heat sink is often mounted to a CPU to aid in dissipating heat therefrom.
A conventional heat sink comprises a plane base positioned on and in contact with an electronic device from which heat is to be removed, and a plurality of fins extending from the base. A fan is often mounted to the fins to cause air to flow through the fins and toward the base, thereby establishing a forced convection and thus more efficiently removing heat from the electronic device. However, the air flow has a tendency to rebound from the base since the base is plane, and this reduces the efficiency of the forced convection. Examples of convention heat sinks are disclosed in Taiwan Patent Application No. 84201742 and U.S. Pat. No. 5,421,406.
Thus, a heat sink which overcomes the above-described problems is desired.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat sink which dissipates heat efficiently.
Another object of the present invention is to provide a heat sink wherein a gap is formed between fins of the heat sink and a plate thereof to promote air flow through the heat sink and thus enhance heat convection.
A further object of the present invention is to provide a heat sink comprising a fan for generating air flow, the air flow being guided by a curved surface on the heat sink for reducing resistance against air flowing through the heat sink.
A further object of the present invention is to provide a heat sink promoting a smoother flow of air therethrough, thereby enhancing operation thereof.
To achieve the above-mentioned objects, a heat sink in accordance with the present invention comprises a base and a number of fins. The base comprises a bottom plate to be positioned on and in contact with an electronic package and a column extending from the bottom plate opposite the electronic package. The fins are arranged in a ring and extend radially from the column. A lower edge of the fins is distanced from the bottom plate by a gap therebetween to facilitate the flow of air through the heat sink. A curved surface may be formed between the column and the base for guiding the air flow away from the fins.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed embodiment of the present invention with attached drawings, in which:


REFERENCES:
patent: 2745895 (1956-05-01), Lideen
patent: 2917286 (1959-12-01), Deakin
patent: 3023264 (1962-02-01), Allison
patent: 3152217 (1964-10-01), Balchaitis
patent: 3185756 (1965-05-01), Allison
patent: 3260787 (1966-07-01), Finch
patent: 3372733 (1968-03-01), Callender
patent: 5019940 (1991-05-01), Clemens
patent: 5375652 (1994-12-01), Matsunaga et al.
patent: 5412535 (1995-05-01), Chao et al.
patent: 5784255 (1998-07-01), Wyland
patent: 5794685 (1998-08-01), Dean
patent: 6199625 (2001-03-01), Guerrero
patent: 6209623 (2001-04-01), Tantoush

Affiliated with

Also associated with

Rating

Heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2566226