Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2000-06-23
2001-12-11
Sircus, Brian (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C362S084000
Reexamination Certificate
active
06328575
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to electrical connectors and contacts and, in particular, to a connector for releasably attaching an electroluminescent lamp to a printed circuit board.
2. Description of the Related Art
Electroluminescent (EL) lamps are widely used in applications in which a lamp is connected to a printed circuit board (PCB). In particular, EL lamps are utilized in a wide variety of electronic devices, such as cellular telephones, personal digital assistants (PDAs), and navigation units, for backlighting displays and keypads and for displaying information. An electroluminescent (EL) lamp typically has first and second outer, conductive layers. A dielectric layer is sandwiched between the two conductive layers. The dielectric layer conventionally includes an electroluminescent powder or, alternatively, an electroluminescent powder is positioned adjacent the dielectric layer. Application of an electric field across the two conductive outer layers causes the electroluminescent powder, which may be a phosphorous powder, to illuminate, thereby providing a lamp.
A wide variety of connectors are currently used for connecting an EL lamp to a printed circuit board. A continuing problem, however, is the inability to provide such a connection that is reliable, easy and cost effective to implement.
SUMMARY OF THE INVENTION
The present invention is a method and device for connecting an electroluminescent (EL) lamp to a printed circuit board. In a preferred embodiment, the present invention has a pair of clips which are soldered to a printed circuit board. Each clip serves as a connector for releasably connecting an EL lamp to the printed circuit board. In particular, each clip is somewhat U-shaped, having a bottom and a top which overlies the bottom. The clip is formed by bending sheet metal in a manner such that the top overlies the bottom. Thus, the clip has a first outer end that is closed, and a second outer end that is open. Preferably, the bent, closed end is of a sufficient dimension to provide some spacing between the top and the bottom of the clip. However, the top of the clip preferably angles downwardly from the closed end to a location at which the top engages the bottom of the clip. From that point, the top angles back upwardly to the second, open end of the clip, thereby creating a mouth portion of the clip into which the EL lamp may be easily inserted. Additionally, the bottom of each clip preferably has an upward protrusion at a location between the closed outer end and the point at which the top and bottom of the clip engage each other.
During assembly of an electronic device in which the printed circuit board/EL lamp combination is to be used, the clips are soldered onto the printed circuit board at a desired, preferably side-by-side, location. An EL lamp is then positioned into place within the clips by sliding a periphery of the EL lamp toward the clips and into the mouth of the clips. Insertion of the EL lamp causes the top of the clips to raise upwardly so that the EL lamp may pass that location at which the top of each clip contacts its bottom. When the EL lamp is completely inserted into the clips, each of a pair of contact pads on a bottom surface of the EL lamp contacts corresponding clips. In particular, each of a pair of contact pads on the EL lamp contacts the upward protrusion of its corresponding clip. The upward flexing of the top of each clip upon insertion of the EL lamp causes the tops of each clip to bias downwardly against the EL lamp, thereby sandwiching and securely holding the EL lamp in place within the clips. Should the EL lamp need to be removed (such as for repair of the lamp or the printed circuit board), the EL lamp may be easily withdrawn from the clips by applying a pulling force in a direction away from the clips.
In a preferred method of attaching an EL lamp to the printed circuit board according to the principles of the present invention, each clip is arranged in a side-by-side manner on the printed circuit board utilizing surface mount technology. In particular, a first solder screening step is performed during which solder is placed on the printed circuit board at locations corresponding to the desired locations of the clips. Subsequently, utilizing a surface mount device, each clip is positioned in its desired location (i.e., on the respective solder spots). Placement of each clip in its desired location is accomplished utilizing conventional surface mount technology, such as by vacuum-holding a clip until it is placed in its desired location and then releasing the suction of the vacuum and withdrawing the surface mounting device. The printed circuit board is subjected to a reflow solder process, during which the solder is heated to effect the solder between the clips and printed circuit board.
Following the reflow solder process, the EL lamp is placed within the clips. In one embodiment, the EL lamp is manually placed in the clips by moving a periphery of the EL lamp into the open mouth of the clips and applying a sufficient force to cause the top of each clip to flex upwardly, thereby permitting the EL lamp to be further inserted into the clip and, particularly, past the location at which the top of each clip contacts its bottom. When the EL lamp is fully inserted into the clips, the contact pads on the bottom of the EL lamp contact the bottom of corresponding clips. Particularly, each contact pad contacts a corresponding one of the upward protrusions on the bottom of its respective clip.
In an alternative method of attaching the EL lamp to the printed circuit board, the EL lamp is attached to the printed circuit board and, particularly, is positioned in the clips with a surface mount device. In this embodiment, the EL lamp is picked up by the surface mount device (e.g., by vacuum or suction), and moved into position within the clips by the surface mount device. Utilizing a surface mount device to attach the EL lamp to the printed circuit board results in a very efficient, cost effective assembly line process.
In an alternative embodiment of the present invention, the clips have a pair of downwardly extending leads. When mounting the clips to the printed circuit board, these leads are positioned through corresponding through holes and solder is allowed to wick into the holes about the leads, thereby soldering the clips to the printed circuit board.
REFERENCES:
patent: 3558994 (1971-01-01), Bernstein
patent: 4362353 (1982-12-01), Cobaugh et al.
patent: 4647126 (1987-03-01), Sobata, Jr.
patent: 4738625 (1988-04-01), Burton et al.
patent: 5661364 (1997-08-01), Kruskopf
patent: 5759049 (1998-06-01), Gerber
patent: 5868582 (1999-02-01), Jacobi
patent: 5888076 (1999-03-01), Itoh et al.
patent: 5889364 (1999-03-01), McGuigan et al.
patent: 6077095 (2000-06-01), DelPrete et al.
Garmin Corporation
Nguyen Son V.
Rolf Devon A.
Sircus Brian
LandOfFree
Method and device for connecting an EL lamp to a printed... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and device for connecting an EL lamp to a printed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for connecting an EL lamp to a printed... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2559394