Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-05-14
2001-03-27
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S104330, C310S104000, C361S689000, C417S420000
Reexamination Certificate
active
06208512
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates generally to cooling systems, and, more specifically, to hermetically sealed cooling systems with pump driven coolant therein.
Personal computers include a main circuit board, or mother board, having a central processing unit (CPU) in the form of a microprocessor chip. As these main processing chips increase in complexity and processing speed, they generate more and more heat during operation. This heat must be suitably dissipated to protect the processor from thermal damage.
Heat dissipation is typically provided in personal and laptop computers by introducing an air fan inside the computer cabinet for circulating ambient air over the processor for removing heat therefrom by convection. The processor may include radiator fins for increasing the available surface area from which heat may be withdrawn from the processor.
Air cooling of processor chips has been effective for low power computers having limited heat dissipation requirements. However, as the processors improve in capability the corresponding heat dissipation requirements therefor also increase. About 5 watts of heat energy is typical in a low power computer chip, with heat dissipation up to about 150 watts being required for high power computer chips being developed. And, kilowatts of cooling are required for multiprocessor computer servers using many chips.
In view of the critical use often found in computer systems, reliability of the entire system is a paramount design objective. Not only must the computer itself operate without failure, but the cooling system therefor must also operate without failure for a suitably long useful life. Since cooling fans have rotating components, they are subject to wear which can lead to fan failure. High reliability fans are typically more expensive than low reliability fans and affect the overall cost of the computer and its competitiveness.
Accordingly, it is desired to provide an improved cooling system for a computer having a hermetically sealed fluid pump therein.
BRIEF SUMMARY OF THE INVENTION
A hermetic pump includes a housing having a bore, an inlet, and an outlet for channeling a fluid therethrough. A shaft is disposed coaxially in the bore, and includes a journal and an impeller spaced apart therefrom. The shaft is hermetically rotated to pump the fluid through the bore from the impeller and around the journal for developing a hydrodynamic journal bearing. In one embodiment, the pump may be used in a closed loop cooling circuit.
REFERENCES:
patent: 3299819 (1967-01-01), McCoy
patent: 4184090 (1980-01-01), Taiani
patent: 5292284 (1994-03-01), Denk
patent: 5441102 (1995-08-01), Burward-Hoy
patent: 5473508 (1995-12-01), Porter
patent: 5713670 (1998-02-01), Goldowsky
patent: 5731954 (1998-03-01), Cheon
patent: 5823005 (1998-10-01), Alexander
patent: 5924975 (1999-07-01), Goldowsky
patent: 6029742 (2000-02-01), Burward-Hoy
Chiu George Liang-Tai
Ellis Arthur W.
Goldowsky Michael Philip
Mok Lawrence Shungwei
Conte Francis L.
International Business Machines - Corporation
Tolin Gerald
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