Wafer positioning method and apparatus

Details Wafer positioning method and apparatus Wafer positioning method and apparatus

1998-03-17

2000-05-16

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451398, 451903, B24B 100

Patent

active

060629533

ABSTRACT:
The peripheral edge of a wafer is cramped by four cramp rollers which are able to move forward and backward with respect to a reference point, and thereby, the center of the wafer is positioned at the reference point. Then, a notch pin, which is provided on a reference line, is pressed against the peripheral edge of the wafer, and the wafer is rotated about the reference point. Thereby, a notch on the wafer moves to the notch pin, and then, the notch pin fits into the notch. Thus, the wafer is positioned at a predetermined position.

REFERENCES:
patent: 5352249 (1994-10-01), Vollaro
patent: 5700297 (1997-12-01), Vollaro

Affiliated with

Also associated with

Rating

Wafer positioning method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer positioning method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer positioning method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-254212