Semiconductor device and method of fabricating same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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Details

257702, 257701, 437 8, 437180, 437205, 437925, H01L 2334, H01L 2314, H01L 2144

Patent

active

057866368

ABSTRACT:
The heights of intermediate terminal boards are adjusted to compensate for differences in heights of semiconductor elements on a bottom terminal board. The adjustment places the tops of all intermediate terminal boards in a common plane. A top terminal board applies equal force to all intermediate terminal board to provide uniform mechanical, electrical and thermal connection between the semiconductor devices and both the bottom and top terminal boards.

REFERENCES:
patent: 4313128 (1982-01-01), Schlegel et al.
patent: 5221851 (1993-06-01), Gobrecht et al.
patent: 5250821 (1993-10-01), Ferla et al.

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