Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1996-09-24
1998-07-28
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257700, 257727, 257731, 438673, 438701, H01L 23053, H01L 2312
Patent
active
057866325
ABSTRACT:
A method for packaging a semiconductor die includes forming an additional protective layer and conductive traces on the die. The die is then placed in a multi-die holder having electrical connectors for establishing an electrical connection to the conductive traces. The protective layer is formed as a thin or thick film of an electrically insulating material such as a polymer, glass, nitride or oxide. In addition, the protective layer can be formed with a tapered peripheral edge to facilitate insertion of the die into the die holder.
REFERENCES:
patent: 4040084 (1977-08-01), Tanaka et al.
patent: 4341569 (1982-07-01), Yaron et al.
patent: 4451326 (1984-05-01), Gwozdz
patent: 4642670 (1987-02-01), Striny
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4878099 (1989-10-01), Nilarp
patent: 4992849 (1991-02-01), Corbett et al.
patent: 4992850 (1991-02-01), Corbett et al.
patent: 5003368 (1991-03-01), Roggwiller et al.
patent: 5063655 (1991-11-01), Lamey et al.
patent: 5104324 (1992-04-01), Grabbe et al.
patent: 5119171 (1992-06-01), Lesk et al.
patent: 5138434 (1992-08-01), Wood et al.
patent: 5279975 (1994-01-01), Devereaux et al.
patent: 5281852 (1994-01-01), Normington
patent: 5336928 (1994-08-01), Neugebauer et al.
patent: 5413970 (1995-05-01), Russell
patent: 5557148 (1996-09-01), Cain
Doan Trung Tri
Farnworth Warren M.
Jacobson John O.
Wood Alan G.
Cao Phat X.
Chaudhuri Olik
Gratton Stephen A.
Micro)n Technology, Inc.
LandOfFree
Semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-25395