IC socket for IC package

Details IC socket for IC package IC socket for IC package

1998-09-08

2000-05-16

Luebke, Renee S.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439331, H01R 1200

Patent

active

06062874&

ABSTRACT:
In an IC socket in which IC leads of an IC package are pressed down by a presser member so as to be contacted with and retained by contacts arranged on the socket, an IC socket for an IC package comprises an IC mount which is upwardly and downwardly movably interposed between the socket and the presser member. The IC mount is formed with through-holes or through-grooves, and the contacts each having a vertical slit are inserted into the through-holes or through-grooves. The IC leads of the IC package placed on the IC mount are pressed down together with the IC mount by the presser member such that distal end portions of the contacts are relatively protruded upwardly from the through-holes of the IC mount as the IC leads are pressed down, so that the IC leads are pushed into the vertical slits.

REFERENCES:
patent: 4887969 (1989-12-01), Abe
patent: 4984991 (1991-01-01), Nishimoto
patent: 5154619 (1992-10-01), Matsuoka
patent: 5395254 (1995-03-01), Mogi
patent: 5518426 (1996-05-01), Plainer
patent: 5641945 (1997-06-01), Abe et al.

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