Patch antenna construction

Details Patch antenna construction Patch antenna construction

1999-11-11

2001-05-15

Le, Hoanganh (Department: 2821)

Communications: radio wave antennas

Antennas

Microstrip

C343S846000

Reexamination Certificate

active

06232923

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates generally to antennas and, more particularly, concerns patch antennas which have a multi-layered construction.
BACKGROUND OF THE INVENTION
Patch antennas in common use today are typically constructed of three flat, conductive layers in superpose alignment. The first layer typically has a plurality of spaced, conductive, rectangular patches formed on a surface. The second layer is typically a solid conductive layer with a cut-out slot that underlying each rectangular patch of the first layer. The third layer has an arrangement of conductive feed traces which underlie the cut-outs in the second layer.
Conventional patch antennas are constructed by forming the slot (second) and feed (third) layers on a conventional, two-layered printed circuit board. The first layer, with the rectangular metallic sections, is then positioned at a distance above the circuit board through the use of mechanical standoffs, or the like. The expense of the printed circuit board, the patch assembly with the rectangular sections, and the standoffs makes the patch antenna a relatively high cost item.
It is an object of the present invention to provide a patch antenna structure which is relatively inexpensive, yet is able to maintain the accuracy required in the positioning of the components of each of the layers of the antenna and the relative positioning of the layers.
SUMMARY OF THE INVENTION
In accordance with the present invention, all of the conductive layers corresponding to a patch antenna are formed on a single substrate, as by printing a conductive ink. Preferably, the substrate is in the form of an elongated, non-conductive, flexible sheet with the consecutive antenna layers printed thereon side-by-side. The layers of the antenna can then be brought into superposed alignment by appropriate folding of the sheet. The conductive patches can be maintained in spaced alignment to the cut-outs by placing a porous non-conductive block or frame of spacing material therebetween. In a preferred embodiment the assembled structure has the various layers bonded together.


REFERENCES:
patent: 4806941 (1989-02-01), Knochel et al.
patent: 6049314 (2000-04-01), Munson
patent: 6072434 (2000-06-01), Papatheodorou

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