Fan-out beams for repairing an open defect

Details Fan-out beams for repairing an open defect Fan-out beams for repairing an open defect

1998-03-31

2001-01-30

Heinrich, Samuel M. (Department: 1725)

Electric heating

Metal heating

By arc

C219S121770, C427S555000

Reexamination Certificate

active

06180912

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to metal line deposition and, in particular, to laser ablation forward metal line deposition using a fan-out beam.
BACKGROUND OF THE INVENTION
Metal lines are commonly used for connecting circuits in printed circuit boards and multichip modules. Existing metal line deposition techniques include laser chemical vapor deposition and laser deposition from metal precursors. These techniques, however, have certain disadvantages associated with them. Chemical vapor deposition processes require toxic gases and a vacuum chamber. Deposition from metal precursors requires wet processing that can damage or introduce defects in the surrounding circuitry.
A less expensive and more environmentally friendly metal deposition technique is laser ablation. Laser ablation of metal films in general is a known technique wherein a laser beam is focused onto the metal film. The heat and shock wave generated by the laser beam remove, or discharge, particles of the film. Thin films of metals such as copper, gold, silver and aluminum may be easily removed, or ablated, using green light lasers, such as Q-switched doubled Nd:YAG, Nd:YLF, or copper vapor lasers.
One such laser ablation technique involves the use of pulsed-laser deposition in order to layer complex thin films on substrates. Using this technique, a focused laser beam is directed onto a target film at an angle. The plume of particles that are ablated from the film land on a substrate that is positioned parallel to the target. The particles are thus deposited onto the substrate to form a thin epitaxial coating. Both the substrate and the target are contained in a vacuum environment in this technique.
SUMMARY OF THE INVENTION
The present invention provides an apparatus and a method for metal line deposition. A donor plate has a donor substrate transparent to a focused coherent light beam. The donor plate has a donor surface coated with a metallic material. The donor plate is positioned so the coated donor surface is adjacent a deposition substrate. A focused coherent light beam is diffracted to form a plurality of coherent light beams. The plurality of beams are directed through the donor substrate and arranged along a line on the metallic material coating the donor surface. The plurality of beams cause the metallic material to ablate from the donor surface by discharging ions of the metallic material away from the donor plate and onto the deposition substrate to form the metal line. Either the plurality of beams or the donor plate and deposition plate are actuated so the metallic material is ablated from the donor plate in a direction parallel to the metal line to be deposited.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention.


REFERENCES:
patent: 3560258 (1971-02-01), Brisbane
patent: 3781978 (1974-01-01), Intrator et al.
patent: 4349583 (1982-09-01), Kulynych et al.
patent: 4432855 (1984-02-01), Romankiw et al.
patent: 4622058 (1986-11-01), Leary-Renick et al.
patent: 4714628 (1987-12-01), Eloy
patent: 4725877 (1988-02-01), Brasen et al.
patent: 4734550 (1988-03-01), Imamura et al.
patent: 4752455 (1988-06-01), Mayer
patent: 4758388 (1988-07-01), Hamada et al.
patent: 4832798 (1989-05-01), Cvijanovich et al.
patent: 4895735 (1990-01-01), Cook
patent: 4933204 (1990-06-01), Warren, Jr. et al.
patent: 4964698 (1990-10-01), Rowlette
patent: 4987006 (1991-01-01), Williams et al.
patent: 4987007 (1991-01-01), Wagal et al.
patent: 5057184 (1991-10-01), Gupta et al.
patent: 5079070 (1992-01-01), Chalco et al.
patent: 5141602 (1992-08-01), Chen et al.
patent: 5153408 (1992-10-01), Handford et al.
patent: 5168454 (1992-12-01), LaPlante et al.
patent: 5173441 (1992-12-01), Yu et al.
patent: 5175504 (1992-12-01), Henley
patent: 5177594 (1993-01-01), Chance et al.
patent: 5203929 (1993-04-01), Takayanagi et al.
patent: 5235272 (1993-08-01), Henley
patent: 5246745 (1993-09-01), Baum et al.
patent: 5330968 (1994-07-01), Nagaishi et al.
patent: 5492861 (1996-02-01), Opower
patent: 5567336 (1996-10-01), Tatah
patent: 5683601 (1997-11-01), Tatah

Affiliated with

Also associated with

Rating

Fan-out beams for repairing an open defect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fan-out beams for repairing an open defect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fan-out beams for repairing an open defect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2532169