Low threshold MOS two phase negative charge pump

Miscellaneous active electrical nonlinear devices – circuits – and – Specific identifiable device – circuit – or system – With specific source of supply or bias voltage

Reexamination Certificate

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C257S368000, C257S372000, C257S544000

Reexamination Certificate

active

06285240

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates charge pump circuits, and to integrated circuits using charge pumps to produce on-chip voltages outside the range of the supply potentials.
2. Description of Related Art
Charge pump circuits are used to generate voltages on integrated circuits and elsewhere, which are higher than or more negative than input supply voltages. Charge pump circuits also called voltage booster circuits and voltage level shifting circuits, are becoming more important as low power applications of integrated circuits are designed to work with lower supply potentials. Thus, as integrated circuits work with supply potentials in the range of 2 to 3 volts or lower, and as circuits on the integrated circuits require operating voltages which are on the order of 5 volts or higher, or require operating voltages which are negative, charge pump circuits are becoming more important.
Representative prior art for charge pump circuits, and particularly negative charge pumps, are described in U.S. Pat. No. 5,489,870 entitled VOLTAGE BOOSTER CIRCUIT; U.S. Pat. No. 5,612,921 entitled LOW SUPPLY VOLTAGE NEGATIVE CHARGE PUMP; U.S. Pat. No. 5,502,629 entitled DC-DC CONVERTER; and in Choi, et al., FLOATING-WELL CHARGE PUMP CIRCUITS FOR SUB-2.0 v SINGLE POWER SUPPLY FLASH MEMORY, 1997 Symposium on VLSI Circuits Digest of Technical Papers, pages 61-62, Jun. 12-14, 1997. Also, prior art charge pump circuitry is disclosed in International Patent Application having Publication Number WO 98/16010 entitled TRIPLE WELL CHARGE PUMP which was owned at the time of invention and is currently owned by the same assignee as the present application.
As is disclosed in the International Application WO 98/16010, triple well transistors can be utilized in charge pumps to increase the efficiency. The triple well transistor comprises a MOS transistor which has source and drain regions of one conductivity type such as n-type, a channel well in which the source and drain regions are formed, of the opposite conductivity such as p-type, and an isolation well of the first conductivity type in which the channel well is formed. All of this is established in a substrate having the second conductivity type. The triple well transistor allows for isolation of the pump transistors from the substrate, as well as allowing for biasing of the channel regions of the transistors to reduce the body effect, and therefore reduce the threshold drop across the transistor. By reducing the threshold drop, efficiency of the charge pump is improved because less voltage is lost as the pumped charge is transferred from one stage to the next.
FIG. 1
illustrates a prior art negative charge pump using triple well n-type MOS transistors. In
FIG. 1
, an input node
10
is clamped to ground through a first triple well n-channel MOS (NMOS) transistor
11
. The transistor
11
has its source, gate and channel well coupled to node
10
. The source of transistor
11
is connected to ground. The isolation well is coupled to the supply potential VDD. Node
10
is also coupled across a capacitor
12
to a clock signal. A second transistor
13
has its source connected to node
10
, and its gate, channel well, and drain coupled to node
14
. The isolation well of transistor
13
is also connected to the supply potential VDD. Node
14
is connected through a capacitor
15
to a clock signal which is 180° out of phase with the clock signal applied to capacitor
12
. Also, a clamp transistor
16
formed using a triple well NMOS device has its source connected to ground, and its gate, drain and channel well connected to node
14
. The isolation well of transistor
16
is connected to the supply potential VDD. Finally, node
14
is connected to the source of a fourth transistor
17
. The gate, drain and channel well are coupled to an output terminal
18
. The isolation well is coupled to the supply potential VDD. The clock signals are illustrated at traces
19
and
20
in FIG.
1
. Basically the transistors
13
and
17
are connected in a diode configuration. The isolation well is connected to VDD, or another potential between zero and the supply to potential to avoid a pn junction turn on between the isolation well and the substrate.
In operation, the node
10
is clamped to a voltage near a threshold above ground. When the clock signal CK on capacitor
12
transits from VDD to ground, node
10
is pushed negative by an amount near the absolute value of VDD. This back biases the clamp transistor
11
, allowing node
10
to go negative. As node
10
goes negative, charge is transferred through transistor
13
to node
14
. This pulls node
14
to a voltage below the bias point established by transistor
16
. On the falling edge of the signal CKB across capacitor
15
, node
14
is pushed even further negative, and the charge is transferred across transistor
17
to the output terminal
18
.
One problem with a triple well MOS connected transistor of the type shown, is the formation of the parasitic NPN bipolar transistor between the n-diffusion of the source, the channel well which is p-type, and the isolation well which is n-type. In this case, the channel well acts as the base of the NPN transistor. The NPN transistor can turn on if the emitter formed by the source of the NMOS transistor falls to a level more than the NPN threshold less than the base. This causes current flow from the isolation well into the source of the NMOS transistor and decreases pump efficiency.
Thus, the parasitic NPN transistor in the charge transfer transistor
13
may experience a condition in which its emitter (the source of NMOS
13
) is biased at a negative voltage after the falling edge of the clock CK while its collector (isolation well at VDD) and base (channel well at node
14
) are at higher potentials. In this case, parasitic NPN transistor in the charge transfer device
13
turns on at the same time as or before the NMOS device
13
begins conducting charge from node
10
to node
14
.
Accordingly, it is desirable to provide an efficient two phase charge pump, which is compact and suitable for use in integrated circuits in the generation of negative voltages.
SUMMARY OF THE INVENTION
The present invention provides a triple well charge pump which overcomes the inefficiencies of the prior art design. The charge pump comprises a first MOS transistor connected in a diode configuration having a first channel terminal, nominally the source, coupled to a first node, and the second channel terminal, nominally the drain, coupled to its gate and to a second node. A first capacitor has a first terminal coupled to the first node of the charge pump, and a second terminal adapted to receive a first clock signal. A second MOS transistor has a first channel terminal coupled to the second node of the charge pump, and a second channel terminal coupled to its gate and to a third node. A second capacitor has a first terminal coupled to the second node, and a second terminal adapted to receive a second clock signal. According to the present invention, the first and second MOS transistors comprise a first region and a second region having a first conductivity type providing the first and second channel terminals respectively, a channel region in which the first and second regions are formed having a second conductivity type, an isolation well having the first conductivity type in a semiconductor substrate of the second conductivity type. The first region, the channel region and the isolation well form a parasitic bipolar junction transistor that has a threshold voltage. The channel regions have doping concentrations establishing threshold voltages for the MOS transistors which are less than the threshold voltages of the parasitic bipolar junction transistors.
According to various aspects of the invention, the parasitic bipolar junction transistor has a threshold voltage of about 0.6 volts, and the first and second MOS transistors have lower threshold voltages. The lower threshold voltages are established according to one aspect of the i

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