Polyetherimide resin compositions with improved ductility

Details Polyetherimide resin compositions with improved ductility Polyetherimide resin compositions with improved ductility

1997-12-23

2001-04-24

Niland, Patrick D. (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C524S123000, C524S176000, C524S154000, C524S204000, C524S327000, C524S330000, C524S580000, C525S09200D, C525S09200D, C525S09200D, C525S09200D, C525S101000, C525S102000, C525S183000, C525S208000, C525S464000, C525S463000, C525S467000, C525S468000, C525S479000

Reexamination Certificate

active

06221940

ABSTRACT:

FIELD OF THE INVENTION
The invention relates to polyetherimide resin compositions that exhibit improved ductility.
BRIEF DESCRIPTION OF THE RELATED ART
Thermoplastic resin blends containing a polyetherimide resin and a copolymer of an &agr;-olefin and an &agr;,&bgr;-unsaturated glycidyl ester that are said to exhibit good impact characteristics, have been disclosed in Japanese Patent Application No. 58-57633, publication number JP 59182847-A.
It is believed that polyetherimide/glycidyl ester blends would find wider applicability if their impact strength and ductility, particularly at low temperatures, could be further improved.
SUMMARY OF THE INVENTION
The present invention is directed to a thermoplastic resin composition, comprising, based on 100 parts by weight (“pbw”) of the thermoplastic resin composition:
(a) a polyetherimide resin,
(b) a glycidyl ester impact modifier, and
(c) an amount of an organometallic compound that is effective to improve the ductility of the thermoplastic resin composition.
The thermoplastic resin composition of the present invention exhibits improved impact strength and ductility.
DETAILED DESCRIPTION OF THE INVENTION
In a preferred embodiment, the thermoplastic resin composition of the present invention comprises from 88 to 99.5 pbw, more preferably from 90 to 99 pbw and still more preferably from 92 to 98 pbw, of the polyetherimide resin; from 0.5 to 12 pbw, more preferably from 1 to 10 pbw and still more preferably from 2 to 8 pbw, of the glycidyl ester impact modifier and from about 0.01 to about 0.2 pbw, more preferably from 0.01 to 0.1 pbw and still more preferably from 0.02 to 0.08 pbw, of the organometallic compound, each based on 100 pbw of the combined amount of polyetherimide resin and glycidyl ester impact modifier.
In a second preferred embodiment, the thermoplastic resin composition of the present invention comprises a polyetherimide resin, a glycidyl ester impact modifier and an effective amount of an organometallic compound and further comprises a polycarbonate resin and a siloxane-polyetherimide copolymer. In a more highly preferred embodiment, the thermoplastic resin composition of the present invention comprises from 31 to 98 pbw, more preferably from 40 to 93 pbw and still more preferably from 39 to 81 pbw, of the polyetherimide resin; from 0.5 to 12 pbw, more preferably from 1 to 10 pbw and still more preferably from 2 to 8 pbw, of the glycidyl ester impact modifier; from 0.01 to 2.0 pbw, more preferably from 0.01 to 0.1 pbw and still more preferably from 0.02 to 0.08 pbw, of the organometallic compound, from 1 to 45 pbw, more preferably from 5 to 40 pbw and still more preferably from 15 to 35 pbw, of the polycarbonate resin; and from 0.5 to 12 pbw, more preferably from 1 to 10 pbw and still more preferably from 2 to 8 pbw of the siloxane-polyetherimide copolymer, each based on 100 pbw of the combined amount of polyetherimide resin, glycidyl ester impact modifier, polycarbonate resin and siloxane-polyetherimide copolymer.
In a third preferred embodiment, the thermoplastic resin composition of the present invention comprises a polyetherimide resin, a glycidyl ester impact modifier, an effective amount of an organometallic compound, a polycarbonate resin and a siloxane-polyetherimide copolymer and further comprises a siloxane-polycarbonate copolymer. In an even more highly preferred embodiment, the thermoplastic resin composition of the present invention comprises from 19 to 98.5 pbw, more preferably from 30 to 92 pbw and still more preferably from 31 to about 79 pbw, of the polyetherimide resin; from 0.5 to 12 pbw, more preferably from 1 to 10 pbw and still more preferably from 2 to 8 pbw, of the glycidyl ester impact modifier; from 0.01 to 0.2 pbw, more preferably from 0.01 to 0.1 pbw and still more preferably from 0.02 to 0.08 pbw, of the organometallic compound, from 1 to 45 pbw, more preferably from 5 to 40 pbw and still more preferably from 20 to 35 pbw of the polycarbonate resin; from 0.5 to 12 pbw, more preferably from 1 to 10 pbw and still more preferably from 2 to 8 pbw of a siloxane-polyetherimide copolymer and from 0.5 to 12 pbw, more preferably from 1 to 10 pbw and still more preferably from 2 to 8 pbw of the siloxane-polycarbonate copolymer, each based on 100 pbw of the combined amount of polyetherimide resin, glycidyl ester impact modifier, polycarbonate resin, siloxane-polyetherimide copolymer and the siloxane-polycarbonate copolymer.
Polyetherimide resins suitable for use as the polyetherimide resin component of the thermoplastic resin of the composition of the present invention are known compounds whose preparation and properties have been described, see generally, U.S. Pat. Nos. 3,803,085 and 3,905,942, the respective disclosures of which are incorporated herein by reference.
In a preferred embodiment, the polyetherimide resin component of the present invention contains from greater than 1 to 1000 or more, preferably from 10 to 1000, structural units of the formula (I):
wherein the divalent T moiety bridges the 3,3′, 3,4′, 4,3′, or 4,4′ positions of the aryl rings of the respective aryl imide moieties of formula (I); T is —O— or a group of the formula —O—Z—O—; Z is a divalent radical selected from the group consisting of formulae (II):
wherein X is a member selected from the group consisting of divalent radicals of the formulae (III):
wherein y is an integer from 1 to about 5, and q is 0 or 1; R is a divalent organic radical selected from the group consisting of: (a) aromatic hydrocarbon radicals having from 6 to about 20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals having from 2 to about 20 carbon atoms, (c) cycloalkylene radicals having from 3 to about 20 carbon atoms, and (d) divalent radicals of the general formula (IV):
where Q is a member selected from the group consisting of formulae (V):
where y′ is an integer from about 1 to about 5.
In one embodiment, the polyethermide resin may be a copolymer which, in addition to the etherimide units described above, further contains polyimide repeating units of the formula (VI):
wherein R is as previously defined for formula (I) and M is selected from the group consisting of formula (VII):
formula (VIII):
and formula (IX):
Polyetherimide resins are made by known methods, such as, for example, those disclosed in U.S. Pat. Nos. 3,847,867, 3,814,869, 3,850,885, 3,852,242 3,855,178 and 3,983,093, the disclosures of which are hereby incorporated herein by reference.
In a preferred embodiment, the polyetherimide resin is made by the reaction of an aromatic bis(ether anhydride) of the formula (X):
with an organic diamine of the formula (XI):
H
2
N—R—NH
2
  (XI)
wherein T and R are defined as described above in formula (I). In general the reactions can be carried out employing well-known solvents, e.g., o-dichlorobenzene, m-cresol/toluene and the like to effect interaction between the anhydride of formula (X) and the diamine of formula (XI), at temperatures from about 100° C. to about 250° C. Alternatively, the polyethermide resin can be prepared by melt polymerization of aromatic bis(ether anhydride)s and diamines accomplished by heating a mixture of the ingredients at elevated temperatures with concurrent stirring. Generally melt polymerizations employ temperatures between about 200° C. and 400° C. Chain stoppers and branching agents may also be employed in the reaction.
Examples of specific aromatic bis(ether anhydrides) and organic diamines are disclosed, for example, in U.S. Pat. Nos. 3,972,902 and 4,455,410, which are incorporated by reference herein.
Illustrative examples of aromatic bis(ether anhydride)s of formula (X) include: 2,2-bis(4-(3,4-dicarboxyphenoxy)phenyl)propane dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl ether dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)benzophenone dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride; 2,2-bis([4-(2,3-dicarboxyphenoxy)phenyl&r

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