Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate
1999-08-04
2001-08-28
Dinkins, Anthony (Department: 2831)
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
C361S306100, C361S306300
Reexamination Certificate
active
06282077
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a mounting structure for a non-polar inorganic ceramic capacitor having a steatite, titanium, barium titanate, strontium or similar ceramic as a dielectric material on to which electrodes are directly printed.
2. Description of the Related Art
Examples of conventional ceramic capacitors of this sort include the flat type illustrated in
FIG. 1
, and the block type illustrated in FIG.
2
. Flat-type ceramic capacitor comprises a flat capacitor element
1
and flat electrodes
2
a
and
3
a
attached to the upper and lower surfaces thereof. The object of the electrodes
2
a
and
3
a
is both to cool the capacitor element
1
and to provide conductivity.
Block-type ceramic capacitor comprises a block-shaped capacitor element
4
, and L-shaped electrodes
5
,
6
which are attached to the bottom of the capacitor element
4
and connected electrically thereto. The object of the L-shaped electrodes
5
,
6
is simply to provide conductivity.
Conventional ceramic capacitors as described above are characterized by high dielectric constant (permittivity), and can thus be rendered compact, while the fact that the capacitor element is inorganic brings the added advantage of relative absence of functional deterioration.
However, it is a common requirement according to application, as for instance in a power converter, that it be possible to lower the impedance in the wiring route connecting the ceramic capacitor and other electronic components.
SUMMARY OF THE INVENTION
Accordingly, one object of the present invention is to provide a novel ceramic capacitor mounting structure wherein it is possible to lower the impedance in the wiring routes connecting the ceramic capacitor and other electronic components, while at the same achieving an excellent cooling effect.
With a view to attaining the aforesaid object, the present invention is a ceramic capacitor mounting structure comprising a flat capacitor element, and first and second electrodes connected to an opposite surface of the capacitor element respectively, and having extension member which extend outward from the periphery of the capacitor element respectively; and
first and second connectors attachable to the extension member of the first and second electrodes respectively.
By virtue of the present invention, impedance in the wiring route between the capacitor element and the bus bars is reduced, while the extensions to the electrodes act as a radiation fin, thus improving the cooling effect.
With a view to attaining the aforesaid object, the present invention is a ceramic capacitor mounting structure comprising
a ceramic capacitor comprising:
a flat capacitor element;
a first and second electrodes connected respectively to opposite surfaces of the capacitor element; wherein the ceramic capacitor is located between direct-current terminals of an inveter designed to permit a two-level alternating-current output; and
the direct-current terminals and the first and second electrodes being connected electrically and mechanically.
The fact that by virtue of the present invention the direct-current terminals and the electrodes of the capacitor are directly connected in this manner contributes to achieving lower impedance.
With a view to attaining the aforesaid object, the present invention is a ceramic capacitor mounting structure comprising
a ceramic capacitor comprising:
a flat capacitor element;
a first and second electrodes connected respectively to opposite surfaces of the capacitor element; wherein two ceramic capacitors are respectively located between a neutral terminal and direct-current terminals of an inverter to permit a three-level alternating-current output; and
the neutral terminal and the first and second electrodes being each connected electrically and mechanically.
The fact that by virtue of the present invention the direct-current terminal and the neutral terminal are directly connected in this manner to the electrodes of the first capacitor, while the neutral terminal and the direct-current terminal are directly connected to the electrodes of the second capacitor contributes to achieving lower impedance.
With a view to attaining the aforesaid object, the present invention is a ceramic capacitor mounting structure comprising a flat capacitor element; a single electrode connected electrically to one surface of the capacitor element; an electrode body connected electrically to the other surface of the capacitor element; and a coolant passage structuring member fashioned integrally with the electrode body and carrying a coolant to facilitate the cooling of the electrode body.
By virtue of the present invention the upper electrode is cooled in this manner, as is the capacitor element, a configuration which contributes to rendering the structure more compact.
With a view to attaining the aforesaid object, the present invention is a ceramic capacitor mounting structure comprising a flat capacitor element; a single electrode connected electrically to one surface of the capacitor element; an electrode body connected electrically to the other surface of the capacitor element; and a cooling fin fashioned integrally with the electrode body and serving to increase the radiation effect.
By virtue of the present invention the upper electrode is cooled in this manner by the cooling fin, as is the capacitor element, a configuration which contributes to rendering the structure more compact.
With a view to attaining the aforesaid object, the present invention is a ceramic capacitor mounting structure comprising a plurality of ceramic capacitors comprising a flat capacitor element and two electrodes each connected electrically to opposite surfaces of the capacitor element,
wherein the ceramic capacitors are located between two flexible bus bars, and the electrodes are connected electrically and mechanically to the flexible bus bars respectively.
The fact that by virtue of the present invention a plurality of ceramic capacitors is connected parallelly in this manner with the aid of the flexible bus bars contributes to achieving lower impedance because it allows the wiring route to be shortened in comparison with a conventionally-wired parallel connection.
With a view to attaining the aforesaid object, the present invention is a ceramic capacitor mounting structure comprising a single ceramic capacitor which comprises a flat capacitor element and a electrode connected electrically to one surface of the capacitor element;
a single semiconductor power element which comprises a semiconductor power element chip mounted on and connected electrically to a substrate with a pattern wiring;
wherein the ceramic capacitor and the semiconductor power element are connected electrically in parallel, and
a wiring for use in external connection being located between the other surface of the capacitor element and the other surface of the chip, the capacitor element and the chip being connected electrically and mechanically.
By virtue of the present invention this configuration contributes to achieving lower impedance because it allows the wiring route between the capacitor element and the semiconductor power element chip to be shortened.
With a view to attaining the aforesaid object, the present invention is a ceramic capacitor mounting structure wherein a snubber circuit comprising a serially connected diode and capacitor is connected electrically to a single semiconductor power element in parallel fashion; the ceramic capacitor comprising a flat capacitor element and a single electrode connected electrically to one surface of the capacitor element; the diode comprising a substrate with a wiring pattern, and diode chip mounted on and electrically connected to the substrate; and the surface of the capacitor element to which no electrode is connected, and the wiring pattern on the surface of the substrate on which no diode chip is mounted are connected electrically.
The fact that by virtue of the present invention the capacitor element and DBC (that is to say, Direct Bonding
Dinkins Anthony
Foley & Lardner
Kabushiki Kaisha Toshiba
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