Abrading – Abrading process
Reexamination Certificate
1998-11-17
2001-05-08
Banks, Derris H. (Department: 3723)
Abrading
Abrading process
C451S041000, C451S386000, C451S391000
Reexamination Certificate
active
06227941
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to multi-layer integrated circuit (IC) devices, and more particularly to a support structure for use during package removal from multi-layer IC devices attached at a frontside to the packages.
BACKGROUND OF THE INVENTION
For multi-layer IC devices attached at a frontside to packaging, e.g., oriented in a flip-chip orientation, debugging for defects in the IC is difficult due to having to approach the desired layers from the backside of the device.
FIG. 1
illustrates a sideview block diagram of a typical flip-chip configuration. As shown in
FIG. 1
, an IC device
10
is coupled to a ceramic package
12
(e.g., a C4 package) via solder bumps
14
. The solder bumps
14
act as chip-to-carrier interconnects to attach the IC device
10
to the ceramic package
12
and to mate with corresponding pad patterns to form the necessary electrical contacts between the circuit(s) of the IC device
10
and pins of the package
12
.
Testing of the circuit remains a challenge due to the upside-down nature of the flip-chip orientation. While the circuit may be approached through the backside layers, such techniques are usually not preferred due to the difficulties associated with having to access the layers in an unconventional order. Further, these techniques normally reduce the thickness of the device to reach the circuit, making the device extremely fragile and cumbersome to handle and utilize during testing. Other attempts involve removal of the package to allow testing from a frontside. However, package removal techniques also carry a risk of device damage when trying to overcome the strong solder bond between the device and the package. Other techniques try to reduce the thickness of the package to assist in the package removal. Unfortunately, these techniques suffer the risk of package breakage.
Accordingly, a need exists for a structure that supports a device during a separation procedure that reduces risk of damage. The present invention addresses such a need.
SUMMARY OF THE INVENTION
The present invention provides aspects for supporting a package and a device coupled to the package at a device frontside during package removal. In an exemplary aspect, a support structure includes a support frame supporting the package substantially near end portions of the package, and multi-layer support material provided within the support frame, wherein breakage of the package during grinding of the package at its backside is reduced. The multi-layer support material further includes a hard wax layer substantially covering the device, an epoxy glue layer substantially covering the hard wax layer, and a soft wax layer substantially covering the epoxy glue layer and substantially filling remaining space within the support frame.
Through the present invention, reduced risk of package breakage is achieved during grinding. These and other advantages of the aspects of the present invention will be more fully understood in conjunction with the following detailed description and accompanying drawings.
REFERENCES:
patent: 5455455 (1995-10-01), Badehi
patent: 5904489 (1999-05-01), Khosropour et al.
Advanced Micro Devices , Inc.
Banks Derris H.
McDonald Shantese
Sawyer Law Group LLP
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