Non-volatile semiconductor memory IC

Static information storage and retrieval – Floating gate – Particular biasing

Reexamination Certificate

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Details

Other Related Categories

C365S185330, C365S200000, C365S201000

Type

Reexamination Certificate

Status

active

Patent number

06198663

Description

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates to an integrated circuit (IC) mounting a non-volatile semiconductor memory such as a flash memory, as well as an IC having a CPU also mounted thereon. In particular, the invention relates to the technology of making use of the results of a burn-in test on such an IC for its later use.
FIG. 4
shows a conventional non-volatile semiconductor memory IC
10
of a simple structure, mounting a non-volatile semiconductor memory serving as a flash memory
11
. Many memory cells which can be electrically erased and rewritten simultaneously are arranged in arrays in the flash memory
11
, and an access circuit
12
comprising address decoders and sense amplifiers is attached to it. If a control signal for a read or write operation with an address signal A is received by the access circuit
12
from outside through a terminal
13
, the corresponding address in the flash memory
11
is accessed and an operation such as the output of a data signal D is carried out.
FIG. 5
shows another conventional IC
20
having not only a flash memory
11
(a non-volatile semiconductor memory) but also a CPU
21
mounted on one chip. This IC
20
includes a bus line
22
for connecting the CPU
21
with the flash memory
11
such that the CPU
21
can access the flash memory
11
therethrough. A ROM
23
for storing application programs and a DRAM
24
for carrying out operations may be also included and connected to the bus line
22
, depending on the nature of the application. Also included is a logic circuit
25
for switching the access to the flash memory
11
selectively either through the CPU
21
or directly through terminals
13
. If signals such as a mode signal M or a reset signal R are inputted from outside to the logic circuit
25
through terminals
26
, suitable selection-switching signals S
1
and S
2
are generated according to the mode specified at the time of a reset. In a normal mode, the CPU
21
will be caused to access the flash memory
11
through the bus line
22
in response to selection-switching signal S
1
. In a test mode in view, for example, of a burn-in test, on the other hand, the access circuit
12
will serve to switch the connection of the flash memory
11
, separating the flash memory
11
from the bus line
22
and connecting it to the terminals
13
. Thus, as is the case with the IC
10
described above with reference to
FIG. 4
, a direct external access to the flash memory
11
through the terminals
13
becomes effective in such a test mode.
Japanese Patent Publication Tokkai 9-219099 disclosed still another IC which is functionally somewhere between the ICs
10
and
20
described above, being characterized as comprising a so-called self burn-in circuit, instead of a CPU, together with a flash memory for carrying out a burn-in test. In addition to the functions of the IC
10
of
FIG. 4
, this IC is adapted to carry out a test such as a burn-in test even in the absence of a signal input indicative of a test mode and to transmit the test results to a tester.
Either all or selected ones of such prior art non-volatile semiconductor memory ICs are subjected to a burn-in test. Such a burn-in test which has been carried out conventionally is schematically shown in FIG.
6
. Since it is desirable to increase the yield of products, and since it is possible, even if a tested IC is found to have defective portions in its flash memory, to exclude such defective portions from being accessed and to treat the IC as a non-defective product so long as its total memory capacity is greater than a specified minimum required, the test includes not only a usual burn-in test process but also a subsequent process of writing necessary access data (herein referred to as the “status”) into the tested non-volatile semiconductor memory IC.
To start the subject IC
10
(or
20
, for example) is set inside a heater
30
for a cycle test and a burn-in test with the use of a tester
40
connected to the heater
30
through cables
31
. Since it is the tester
40
that controls the tests, it is the tester
40
that sets the temperature of the heater
30
and accesses the IC
10
, writing and reading data thereinto and therefrom. The results of the tests and the access data obtained by determining good or bad on the basis of obtained test results are outputted, that is, displayed on a display device
41
or a printed out by a printer
42
which may both be attached to the tester
40
.
After the burn-in test is finished, the IC
10
is removed from the heater
30
and is set to a ROM writer
50
for the subsequent write process. Portions corresponding to the IC
10
are extracted from this output obtained, say, through the printer
42
, and a map
11
a
is generated either directly from the portion of the data showing defective parts of the flash memory
11
or after converting such data into a more easily readable format including flag bits and an address list for indicating the addresses of substitute areas. Thereafter, the map
11
a
thus prepared is written on an available area of the flash memory
11
. This process may be carried out by operating the ROM writer
50
while referencing the output data, say, from the printer
42
.
When use is made of an IC
10
having such a map
11
a
written in its flash memory
11
, the map
11
a
serves to prevent data from being written in or read from any of the defective portions of the flash memory
11
. In summary, the results of the burn-in test are reflected in a later process such that even the IC products found to have defective portions in their flash memory can be treated as usable products.
According to this prior art technology, however, the burn-in test process which is carried out by accessing a non-volatile semiconductor memory and the subsequent write process whereby access data based on the test results are written in were separate processes each requiring human efforts. When a large number of ICs are to be processed, the operation of the ROM writer
50
, for example, is enormously time-consuming. Moreover, it involves a cumbersome work to correctly associate the outputted access data with the individual ICs. Since non-volatile semiconductor memories with different memory capacities and structures are required for different applications, furthermore, the tester has to be modified in various ways in order to accommodate all these different kinds of memories.
It now goes without saying that the number of steps should be reduced as much as possible in the process for the testing. In addition, it is desirable to arrange these steps such that they can be performed continuously and automatically and that some apparatus can be used for different purposes or dispensed with. Although it may be said that the IC described in aforementioned Japanese Patent Publication Tokkai 9-219099 has contributed in improving the efficiency in the use of a tester because it contains within itself a self burn-in circuit, the improvement is only in reducing the number of control signals exchanged with the tester during a burn-in test such that a large number of chips can be tested at the same time. The problem of the amount of work to be done by the operator and the adaptability of the tester to a wide variety of ICs has not been considered.
SUMMARY OF THE INVENTION
It is therefore an object of this invention in view of the above to provide non-volatile semiconductor memory ICs on which a burn-in test can be carried out easily and by means of a simple apparatus.
A non-volatile semiconductor memory IC embodying this invention, with which the above and other objects can be accomplished, may be characterized from one point of view as having a non-volatile semiconductor memory mounted thereon and comprising a testing means for accessing the non-volatile semiconductor memory and thereby carrying out a test to determine its good/bad condition and a write means for writing results of this test in the non-volatile semiconductor memory. With a non-volatile semiconductor memory IC thus structured, the results of the burn-in

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