Circuit component mounting system

Details Circuit component mounting system Circuit component mounting system

1998-02-18

2001-08-14

Young, Lee (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S742000, C029S783000, C029S786000, C029S791000, C029S793000, C029S794000, C029S832000, C029S834000, C029S822000, C198S369100, C198S890100

Reexamination Certificate

active

06272737

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a system and a method for mounting circuit components (“CCs”) on a circuit substrate (“CS”).
2. Related Art Statement
FIG. 45
shows a known CC mounting system
900
including a CS supporting device
912
which supports a CS
920
,
921
; a CC mounting device (not shown) which mounts, at a CC mounting position, CCs on the CS
920
,
921
supported by the CS supporting device
912
; a CS carry-in device
914
which carries in the CS
920
,
921
and transfers the CS
920
,
921
to the CS supporting device
912
; and a CS carry-out device
916
which receives, from the CS supporting device
912
, the CS
920
,
921
on which the CCs have been mounted, and carries out the CS
920
,
921
. The CS carry-in and carry-out devices
914
,
916
are provided along a CS carrying route on which the CS
920
,
921
is carried, and the CC mounting device is provided at the CC mounting position offset from the CS carrying route. The CC supporting device
912
includes a main holding device
918
which holds the CS
920
,
921
, and a main-holding-device moving device which moves the main holding device
918
horizontally and vertically. Thus, the CS
920
,
921
held by the main holding portion
918
is horizontally moved between the CC mounting position where the CCs are mounted on the CS
920
,
921
by the CC mounting device and a CS transferring position where the CS
920
,
921
is transferred from the CS carry-in device
914
and to the CS supporting device
912
, and is transferred from the CS supporting device
912
to the CS carry-out device
916
, and where the CS
920
,
921
is vertically moved between a movement height position where the CS
920
,
921
is moved for the CCs to be mounted thereon and a transferring height position where the CS
920
,
921
is transferred between the CS supporting device
912
and the CS carry-in and carry-out devices
914
,
916
.
In the first step shown in
FIG. 45
, the CS
920
is carried in by the CS carry-in device
914
; and, in the second step, the CS
920
is transferred to, and held by, the main holding device
918
being positioned at the CS transferring position and the transferring height position, while the CS
920
is moved in a direction (i.e., horizontal direction) substantially parallel to the plane of the CS
920
. In the third step, the main holding device
918
holding the CS
920
is lowered to the movement height position and then is horizontally moved to the CC mounting position where the CCs are mounted on the CS
920
. In the second step, the CS
921
on which the CCs have been mounted is transferred, at the CS transferring position and the transferring height position, to the CS carry-out device
916
, while the CS
921
is moved in the horizontal direction. Thus, the CS
920
is transferred from the CS carry-in device
914
to the CS supporting device
912
, while the CS
921
is concurrently transferred from the CS supporting device
912
to the CS carry-out device
916
. This CS transferring operation (i.e., the transferring of the CS
920
onto the CS supporting device
912
and the transferring of the CS
921
from the same
912
) needs a long time of about 5 seconds, as illustrated in FIG.
46
. In particular, it is difficult to accelerate the transferring of the CS
921
from the CS supporting device
912
to the CS carry-out device
916
. Meanwhile, if the acceleration and/or deceleration of movement of the CS
921
are/is increased to solve this problem, the CCs mounted on the CS
921
might move because the CCs have only temporarily been fixed to the CS
921
with solder paste or uncured adhesive.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a circuit component mounting system which enjoys improved operation efficiency.
It is another object of the present invention to provide a circuit component mounting method which enjoys improved operation efficiency.
The present invention provides a circuit component mounting system and a circuit component mounting method which have one or more of the technical features which are described below in respective paragraphs given parenthesized sequential numbers (1) to (18). Any technical feature which includes another technical feature shall do so by referring, at the beginning, to the parenthesized sequential number given to that technical feature. Thus, two or more of the following technical features may be combined, if appropriate. Each technical feature may be accompanied by a supplemental explanation, as needed.
(1) According to a first feature of the present invention, there is provided a system for mounting circuit components on a circuit substrate, comprising a circuit-substrate supporting device which supports the circuit substrate; a circuit-component mounting device which mounts, at a circuit-component mounting position, the circuit components on the circuit substrate supported by the circuit-substrate supporting device; and a circuit-substrate carry-out device which carries out the circuit substrate on which the circuit components have been mounted, the circuit-substrate carry-out device comprising a removing device which removes the circuit substrate from the circuit-substrate supporting device, and a parallel-direction carry-out device which receives the circuit substrate from the removing device and carries out the circuit substrate in a parallel direction substantially parallel to a plane of the circuit substrate, wherein the circuit substrate is transferred from the circuit-substrate supporting device to the removing device in a first direction substantially perpendicular to the plane of the circuit substrate, and is transferred from the removing device to the parallel-direction carry-out device in a second direction opposite to the first direction. In the present circuit-component mounting system, the CS (circuit substrate) which is supported by the CS supporting device and on which the CCs (circuit components) have been mounted is removed in the first direction by the removing device, and the removed CS is transferred in the second direction to the parallel-direction carry-out device. The CS transferred to the parallel-direction carry-out device is carried out by being moved in the parallel direction. Thus, in the present system, the removing of the CS from the CS supporting device and the transferring of the CS to the parallel-direction carry-out device are performed in the first and second directions, respectively, each of which is perpendicular to the plane of the CS. In the case where the removing device comprises a holding device which holds the CS, the holding device is only required to be able to remove and transfer the CS in the first and second directions each perpendicular to the plane of the CS, and is not required to be able to remove the CS in the first direction and transfer the CS in the parallel direction. Accordingly, the holding device enjoys a simple construction, which leads to reducing the production cost of the present system. In the case where each of the CS supporting device, the removing device, and the parallel-direction carry-out device comprises a holding device which holds the CS, the respective holding devices of the CS supporting device and the removing device, or the respective holding devices of the removing device and the parallel-direction carry-out device are required to face each other in a state in which the CS can be transferred between the two holding devices. However, if in this state one of the two holding devices is moved in the parallel direction, the other holding device may interfere with the parallel-direction movement of the one holding device. Accordingly, it is desirable that the two holding devices be separated from each other before one of them is moved in the parallel direction. In other words, it is desirable that the CS be transferred between the two holding devices in the first or second direction, in a state in which the holding devices are nearer to each other than they ar

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