Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
1999-08-03
2001-06-12
Font, Frank G. (Department: 2877)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
C385S080000, C385S081000, C385S082000, C385S083000, C385S084000, C385S085000, C385S086000, C385S087000, C385S088000, C385S089000, C385S090000, C385S091000, C385S092000, C385S093000
Reexamination Certificate
active
06244756
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an apparatus and method for bonding optical fiber and/or device to external element using compliant material interface, and more particularly, to an apparatus and method for bonding an optical fiber and/or device to an external substrate for strength, support, and protection.
2. Background of the Related Art
Currently, various techniques exist for stabilizing an optical fiber and/or device to an external substrate. For example, one technique involves using an epoxy to affix the optical fiber to an external substrate. Another technique disclosed in U.S. Pat. No. 5,475,784 to Bookbinder, et al. encapsulates a segment of organic material of an optical component, such as a junction, by directly placing molten metal around the component and solidifying the metal.
However, the resulting bonded optical fiber(s) or device according to these prior techniques often times is not properly protected and/or affixed. These processes are difficult to automate as well. Thus, this process does not provide good yield results. Further, these crude processes limit the types of optical devices that can be packaged and protected thereby.
It is therefore desirable to provide accurate and consistent production of high quality optical fibers and/or devices that are bonded to an external substrate for strength, support, and protection.
It is also desirable to provide high quality optical fibers and/or devices that are packaged to protect same.
It is also desirable to provide production techniques to package optical fibers and/or devices that may be highly temperature sensitive, e.g., planar optical fiber.
It is also desirable to provide production techniques to package and/or hermetically package optical fibers and/or devices quickly, inexpensively and in a highly automated manner.
It is also desirable to provide production techniques to package and/or hermetically package optical fibers and/or devices for a passive fiber optic component manufacturer.
SUMMARY OF THE INVENTION
A feature and advantage of the invention is in providing accurate and consistent production packaging of high quality fiber optic devices.
Another feature and advantage of the invention is that its principal use is, for example, in device production for a passive fiber optic component manufacturer.
Another feature and advantage of the invention is in providing accurate and consistent production of high quality fiber optic devices.
Another feature and advantage of the invention is in providing accurate and consistent production of high quality optical fibers and/or devices that are bonded to an external substrate for strength, support, and protection.
Another feature and advantage of the invention is in providing high quality optical fibers and/or devices that are packaged to protect same.
Another feature and advantage of the invention is in providing production techniques to package optical fibers and/or devices that are highly temperature sensitive.
Another feature and advantage of the invention is in providing production techniques to hermetically package optical fibers and/or devices quickly, inexpensively and in a highly automated manner.
Another feature and advantage of the invention is in providing production techniques to hermetically package optical fibers and/or devices for a passive fiber optic component manufacturer.
The present invention is based, in part, on the discovery or identification of the problem that during standard optical fiber and/or device production, the optical fiber and/or device is not being stabilized, bonded, sealed, hermetically sealed and/or packaged in a quick, inexpensive and highly automated manner. Accordingly, the manufacturing/production industry of optical fibers and/or devices has been unable to meet the demands to satisfy industry needs of same. As a result, optical fibers and/or devices are unnecessarily expensive due to the standard economic supply/demand theory.
Advantageously, I have discovered that a simple procedure may be used to stabilize, bond, seal, hermetically seal and/or package an optical fiber and/or device in a quick, inexpensive and highly automated manner. Accordingly, optical fiber and/or device production will be greatly increased due to this new category or class of techniques described herein.
In addition, I have discovered that the above techniques may be used for highly temperature sensitive optical fibers and/or devices. Further, I have discovered that the above techniques may be used for accurate and consistent production of high quality optical fibers and/or devices that are bonded to an external substrate for strength, support, and protection.
In accordance with one embodiment of the invention, an apparatus includes a device having at least one exposed region. First and second metal seals bond and/or secure with, and surround, the exposed region of the device. An enclosure seals the device between the first and second metal seals. The enclosure has a first substrate and a second substrate, each with end surfaces including a deformable metal layer. The deformable metal layer seals the corresponding surfaces in response to the application of a compressive force and/or energy to the first and second substrates. The enclosure may be constructed to include a cavity, and/or constructed of relative short length. The enclosure may be used to secure to a portion of an optical fiber, fiber optic device and/or device, and/or may be used to encase a portion or all of an optical fiber, fiber optic device and/or device.
In accordance with another embodiment of the invention, an apparatus includes at least one optical fiber, device and fiber optic device, including a region and having a first thermal coefficient of expansion. A first securing material surrounds the region of the at least one optical fiber, device and fiber optic device, and has a second thermal coefficient of expansion greater than the first thermal coefficient of expansion. A cusp has first and second sections and a cavity, and covers the first securing material and the region. The cusp includes an expansion joint between the first and second sections, and the expansion joint has a third thermal coefficient of expansion substantially similar to the second thermal coefficient of expansion.
In accordance with another embodiment of the invention, a method includes the step of providing an optical fiber, device and/or fiber optic device that includes a region and has a first thermal coefficient of expansion. The method includes the step of disposing a securing material at the region of the optical fiber, device and/or fiber optic device. The securing material has a second thermal coefficient of expansion greater than the first thermal coefficient of expansion. The method also includes the step of covering the securing material and the region with first and second sections. The first and second sections have third and fourth thermal coefficients of expansion substantially similar to the first thermal coefficient of expansion. The method also includes the step of providing an expansion joint between the first and second sections. The expansion joint has a fifth thermal coefficient of expansion substantially similar to the second thermal coefficient of expansion. The method also includes the step of applying a compressive force and/or energy to seal, secure and/or hermetically seal the optical fiber, device and/or fiber optic device using the securing material and the first and second sections.
These together with other objects and advantages which will be subsequently apparent, reside in the details of construction and operation as more fully herein described and claimed, with reference being had to the accompanying drawings forming a part hereof wherein like numerals refer to like elements throughout.
REFERENCES:
patent: Re. 33296 (1990-08-01), Stowe et al.
patent: Re. 34955 (1995-05-01), Anton et al.
patent: 3854003 (1974-12-01), Duret
patent: 4026632 (1977-05-01), Hill et al.
patent: 4611894 (1986-09-01), Roberts
patent: 46
Donner Irah H.
Font Frank G.
Hale and Dorr LLP
Rodriguez Armando
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