Heat exchange – Thermosyphonic flue type – Heating or cooling means within distinct flue forming enclosure
Reexamination Certificate
1999-04-30
2001-05-22
Atkinson, Christopher (Department: 3743)
Heat exchange
Thermosyphonic flue type
Heating or cooling means within distinct flue forming enclosure
C165S104330, C165S104260, C165S911000, C361S700000, C257S715000
Reexamination Certificate
active
06234242
ABSTRACT:
FIELD OF THE INVENTION
The invention relates generally to cooling for electronic devices, and more particularly to a two-phase thermosyphon and a method for forming a two-phase thermosyphon.
BACKGROUND OF THE INVENTION
Electronic devices such as power amplifiers, power supplies, multi-chip modules, electronic hybrid assemblies such as power amplifiers, microprocessors and passive components such as filters may contain heat sources which require cooling during normal operation. Various techniques may be used for cooling electronic devices. Traditionally, electronic devices have been cooled by natural or forced air convection which involves moving air past conduction heat sinks attached directly or indirectly to the devices.
Efforts to reduce the size of devices have focused upon increased integration of electronic components. Sophisticated thermal management techniques using liquids, which allow further abatement of device sizes, have often been employed to dissipate the heat generated by integrated electronics.
Two-phase thermosyphons have been developed to provide cooling for electronic devices. Two-phase thermosyphons typically include a two-phase material within a housing. The two-phase material, typically a liquid, vaporizes when sufficient heat density is applied to the liquid in the evaporator section. The vapor generated in the evaporator section moves away from the liquid towards the condenser. In the condenser section, the vapor transforms back to liquid by rejecting heat to the ambient. The heat can be dissipated to the ambient atmosphere by a variety of means, such as natural convection, forced convection, liquid, and other suitable means.
A light structurally robust design for a compact two-phase thermosyphon includes a sealed thin-shell housing with a lanced offset fin core. This design incorporates an integrated evaporator and condenser. However, vapor transport through the lanced offset fin core is typically anisotropic, thereby restrictive in one direction, inhibiting efficient vapor transport within the condenser. This results in significant inefficiency in the thermal performance of the thermosyphon.
There is therefore a need for a light compact two-phase thermosyphon that is structurally robust and thermally efficient.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1
depicts a two-phase thermosyphon including a porous structural material having slots disposed therein in accordance with a preferred embodiment of the present invention; and
FIG. 2
depicts a two-phase thermosyphon including a porous structural material having slots disposed therein in accordance with an alternate embodiment of the present invention.
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Bowers Morris B.
Sehmbey Maninder Singh
Atkinson Christopher
Fekete Douglas D.
MacIntyre John B.
Motorola Inc.
Williams Lalita P.
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