Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
1996-10-21
2001-08-28
Rosenbaum, I Cuda (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S840000, C029S843000, C257S738000, C439S066000, C439S083000, C439S876000
Reexamination Certificate
active
06279227
ABSTRACT:
BACKGROUND TO THE INVENTION
Heretofore many types of interconnections which have been provided for use with the semiconductor devices have suffered from one or more disadvantages limiting their broad application in the semiconductor industry. There is therefore need for new and improved interconnection contact structure which overcomes such disadvantages so that it will be particularly useful in semiconductor assemblies and packages and which can be broadly used throughout the semiconductor industry.
SUMMARY OF THE INVENTION
In general, it is an object of the present invention to provide a contact structure, interposer, a semiconductor assembly and package using the same and a method for fabricating the same which makes it possible to use contact structures and particularly resilient contact structures attached directly to active silicon devices.
Another object of the invention is to provide a structure, interposer, assembly and method which makes it possible to utilize under chip capacitors to save in real estate.
Another object of the invention is to provide a structure, interposer, assembly and method of the above character which can be utilized for providing more than one substrate precursor populated with card ready silicon on both sides which optionally can be interconnected with resilient contacts.
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“Method of Testing Chips and Joining Chips to Substrates” Research Disclosure, No. 322, Feb. 1, 1991, p. 130, XP000169195.
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Khandros Igor Y.
Mathieu Gaetan L.
Blakely & Sokoloff, Taylor & Zafman
Chang Rick Kiltae
Cuda Rosenbaum I
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