Stacked semiconductor device

Details Stacked semiconductor device Stacked semiconductor device

1999-06-15

2001-07-24

Smith, Matthew (Department: 2825)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S712000, C257S720000, C438S015000, C438S106000, C438S121000, C361S719000, C361S720000, C361S729000, C361S736000, C361S748000, C361S752000

Reexamination Certificate

active

06265772

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a stacked semiconductor device having an improved structure for heat dissipation.
This application is based on patent application No. Hei 10-170348 filed in Japan, the content of which is incorporated herein by reference.
2. Description of the Related Art
Ordinary stacked semiconductor devices comprise semiconductor chips
11
a
and
11
b
, module substrates
12
a
and
12
b
, and a mother board
14
as shown in FIG.
9
. The semiconductor chip
11
a
is flip-chip mounted to the module substrate
12
a
, whereby a module is obtained. Similarly, the semiconductor chip
11
b
is flip-chip mounted to the module substrate
12
b
, whereby another module is obtained. Module-stacked body is obtained by stacking these modules. The module-stacked body is stacked on the mother board
14
via connectors
13
as shown in FIG.
9
.
The connectors
13
are positioned in the spaces between the module substrates
12
a
and
12
b
, and the module substrate
12
a
and the mother board
14
. Therefore, the semiconductor chip
11
a
does not contact the module substrate
12
b
, and the semiconductor chip
11
b
also does not contact the mother board
14
. When the semiconductor chip
11
a
contacts the module substrate
12
b
, and the semiconductor chip
11
b
contacts the mother board
14
, the mother board
14
expands due to heat generated by the semiconductor chips
11
a
and
11
b
, or by rising ambient temperature. The semiconductor chips
11
a
and
11
b
are then subjected to excessive pressure, whereby the semiconductor chips
11
a
and
11
b
may be damaged. In order to prevent such damage, only one surface of the semiconductor chip
11
a
contacts the module substrate
12
a
, and only one surface of the semiconductor chip
11
b
contacts the module substrate
12
b
. That is, there is a space between the other surface of the semiconductor chip
11
a
and the module substrate
12
b
. There is also a space between the other surface of the semiconductor chip
11
b
band the mother board
14
.
It is believed that air flows into the spaces; therefore, most of heat generated by the semiconductor chips
11
a
and
11
b
can be dissipated. Therefore, ordinary semiconductor devices do not comprise special structures for heat dissipation.
Another ordinary semiconductor device comprises the semiconductor chips
11
a
and
11
b
mounted on the module substrates
12
a
and
12
b
as shown in FIG.
10
. That is, the semiconductor chip
11
b
is mounted on the module substrate
12
b
so that the semiconductor chip
11
b
does not face toward the mother board
14
. In order to prevent the damage to the semiconductor chips
11
a
and
11
b
by heat, only one surface of the semiconductor chip contacts the module substrate. That is, there is a space between the semiconductor chip
11
b
and the module substrate
12
a.
As described above, most of heat generated by the semiconductor chip is dissipated in the each module; therefore, heat dissipation efficiency of the semiconductor device is low. As a result, the temperature of the operating semiconductor chip becomes high and the semiconductor chip may malfunction. In some cases, the semiconductor chip may be damaged.
It is therefore an object of the present invention to provide a stacked semiconductor device which has an improved structure for heat dissipation and can operate stably semiconductor chips.
SUMMARY OF THE INVENTION
The present invention relates to a stacked semiconductor device which can transfer heat generated by the operating semiconductor chip to the other semiconductor chip and the module substrate, or can dissipate heat. Therefore, heat dissipation efficiency of the semiconductor device is improved, whereby the temperature rise of the operating semiconductor chip can be prevented. As a result, the stacked semiconductor device of the present invention can prevent the malfunctions and damage of the semiconductor chips. Specifically, the stacked semiconductor device of the present invention comprising a mother board and a module-stacked body mounted on the mother board, the module-stacked body comprising stacked two or more modules each of which comprises a module substrate and a semiconductor chip mounted to the module substrate, wherein at least one radiator hole is formed in each of the module substrates and the mother board so that the radiator hole faces to the semiconductor chips.


REFERENCES:
patent: 5825628 (1998-10-01), Garbelli et al.
patent: 5847929 (1998-12-01), Bernier et al.
patent: 5861322 (1999-01-01), Caillat et al.
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5935687 (1999-08-01), Davidson et al.
patent: 5963795 (1999-10-01), Schneider et al.
patent: 5973396 (1999-10-01), Farnworth
patent: 6014313 (2000-01-01), Hesselbom
patent: 6072690 (2000-06-01), Farooq et al.
patent: 6098282 (2000-08-01), Frankeny et al.
patent: 63-14359 (1988-02-01), None
patent: 4-99051 (1992-03-01), None
patent: 5-29533 (1993-02-01), None
patent: H6-85427 (1994-03-01), None
patent: 8-167691 (1996-06-01), None
patent: H8-204072 (1996-08-01), None
patent: 8-279572 (1996-10-01), None
patent: 8-330352 (1996-12-01), None
patent: 9-199629 (1997-07-01), None

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