Method of manufacturing a heat pipe

Details Method of manufacturing a heat pipe Method of manufacturing a heat pipe

1991-02-28

1991-10-08

Cuda, Irene

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

29428, 72368, 156206, 156303, 16510421, B21D 5302

Patent

active

050541960

ABSTRACT:
A wick layer is attached and fixed to one surface of a metal tape without forming a gap with the metal surface, and thereafter, the tape is rolled so that the surface having the wick layer serves as an inner surface, thus forming a pipe shape, then the pipe wall is corrugated. According to the above process, the wick layer is completely and uniformly attached to the inner surface of the heat pipe.

REFERENCES:
patent: 2977914 (1961-04-01), Gray et al.
patent: 3921710 (1975-11-01), Katayama
patent: 4109709 (1978-08-01), Honda et al.
patent: 4283824 (1981-08-01), Schatz et al.
patent: 4660754 (1987-04-01), Byrd
patent: 4724596 (1988-02-01), Paulyak
patent: 4793384 (1988-12-01), Lalikos et al.
Patent Abstracts Of Japan, vol. 10, No. 191 (M-495) (2247), Jul. 4, 1986 & JP-A-61 36 692 (Japan Goatetsukusu K.K.) 2/21/86.
Patent Abstracts Of Japan, vol. 10, No. 155 (M-485) (2211), Jun. 4, 1986 & JP-A-61 8594 (Fujikura Densen K.K.) 1/16/86.
Patent Abstracts Of Japan, vol. 4, 176 (M-45) (658, Dec. 5, 1980; & JP-A-55 123 987 (Nippon Tokushu Togyo K.K.) 9/24/1980.
Patent Abstracts Of Japan, vol. 6 No. 71 (M-126) (949), May 6, 1982 & JP-A-57 10 091 (Fujikura Densen K.K.) 1/19/82.
Patent Abstracts Of Japan, vol. 3, No. 97 (M-69), Aug. 17 1979, p. 137 69; & JP-A-54 73 349 (Sumitomo Denki Kogyo K.K.) 6/12/79.

Affiliated with

Also associated with

Rating

Method of manufacturing a heat pipe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a heat pipe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a heat pipe will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-249282