LGA clamp mechanism

Details LGA clamp mechanism LGA clamp mechanism

1999-06-11

2001-08-28

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S080300, C165S185000, C174S016300, C257S718000, C257S719000, C361S710000, C361S719000, C361S720000

Reexamination Certificate

active

06282093

ABSTRACT:

CROSS REFERENCE TO RELATED APPLICATIONS
Not Applicable
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
Not Applicable
BACKGROUND OF THE INVENTION
Integrated circuits are being made which operate at increasingly faster speeds while taking up a minimal amount of space. As a result, these integrated circuits generate high amounts of heat that must be removed from the integrated circuit in order for the integrated circuit to operate at its maximum performance level. Typically a heatsink is coupled to the integrated circuit to aid in removing heat generated by the integrated circuit.
A variety of mechanisms have been utilized to secure a heatsink to an integrated circuit such as a Land Grid Array (LGA). The LGA device is typically situated in a socket on a printed circuit board and clamped in place with the heatsink. One prior art mechanism utilized a plurality of springs and screws to clamp the device between a socket and heatsink. Each screw was individually adjusted to provide proper biasing of the device within the socket and to provide a strong thermal conduction path between a surface of the heatsink and the device. A drawback associated with such a mechanism is the difficulty in providing uniform pressure to the heatsink, integrated circuit, and the socket. This mechanism is also difficult to assemble due in part to the numerous parts and alignment required. Additional attempts included the use of a combination of spring clamps and clips to secure the heatsink to the socket with the device positioned therebetween. This attempt required the use of a specialized socket and heatsink, and did not allow for adjustment of the tension between the heatsink, device and socket. It would be desirable to have a mechanism that can provide uniform pressure between a heatsink, device and socket and for such a mechanism to be simple to implement and low in cost.
BRIEF SUMMARY OF THE INVENTION
A Land Grid Array (LGA) clamp mechanism is presented. The mechanism includes a spring having a number of beams that mate with cooperating posts of a backing plate. The backing plate fits on the bottom side of a printed circuit board, opposite the area where a device is installed and with the posts extending from the backing plate through openings in the printed circuit board. The LGA device is either inserted into a socket on the top side of the printed circuit board or mounted directly to the top side of the printed circuit board. A heat sink is placed directly on top of the LGA device. The posts from the backing plate extend through the circuit board and through openings in the heatsink. A spring assembly is positioned along a top surface of the heatsink and is secured to the posts. The spring assembly includes a spring and a bias adjustment screw that is adjusted to provide a desired uniform amount of pressure to the heatsink, device and socket. A variety of spring and heatsink configurations may be used as part of the clamp mechanism. Such a mechanism not only provides a uniform amount of pressure but also is additionally simple to install and adjust.


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