Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-04-07
2001-09-25
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S753000, C361S759000, C361S801000, C174S051000, C174S263000
Reexamination Certificate
active
06295210
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The present invention relates to printed wiring board assemblies, and more particularly to a chassis grounding ring for preventing plating over of printed wiring board mounted holes during wave soldering.
BACKGROUND OF THE INVENTION
A printed wiring board (PWB) may be electrically grounded to a chassis using a standoff that is in physical contact with the chassis and the PWB. The standoff is mechanically attached to the PWB utilizing a fastener which passes through an aperture contained on the PWB. This aperture may be a plated hole for creating an electrical connection between both sides of the PWB and the standoff.
To prevent solder from filling the plated hole, tape may be applied to the grounding hole. After the PWB is wave soldered, the tape is removed to expose the hole. The taping process is both time consuming and costly.
A need has thus arisen for a printed wiring board assembly that eliminates the need for taping of chassis ground holes and creates a higher quality and more consistent ground area.
SUMMARY OF THE INVENTION
In accordance with the present invention, a printed wiring board is adapted to be mounted to a chassis using a fastener. The chassis provides an electrical ground for the printed wiring board. The board includes first and second sides and a mounting aperture extending therethrough for receiving the fastener. A plurality of spaced apart solder pads or lands are disposed on one side of the board and adjacent to the mounting aperture. The pads are adapted to provide an electrical connection to the chassis. At lease one aperture is disposed in each of the plurality of pads. The aperture is plated creating an electrical connection between the sides of the board.
REFERENCES:
patent: 4851614 (1989-07-01), Duncan, Jr.
patent: 5326937 (1994-07-01), Watanabe
patent: 5420378 (1995-05-01), Estes et al.
patent: 5668699 (1997-09-01), Bell et al.
patent: 6-283871 (1994-06-01), None
patent: 7-45973 (1995-07-01), None
Lanzone Chris Allan
Pierson Richard A.
Sandage Andrea T.
Gandhi Jayprakash N.
Locke Liddell & Sapp
Lucent Technologies - Inc.
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