Electricity: conductors and insulators – With fluids or vacuum – Boxes and housings
Reexamination Certificate
1995-03-30
2001-03-27
Kincaid, Kristine (Department: 2831)
Electricity: conductors and insulators
With fluids or vacuum
Boxes and housings
C174S050500
Reexamination Certificate
active
06207892
ABSTRACT:
BACKGROUND OF INVENTION
1. Technical Field
This invention relates to a novel method for sealing high density electronic circuits, such as, integrated circuits, by positioning the circuit on a pedestal in the interior of a container. The container is filled with a hydrophobic liquid sufficiently to immerse the circuit and form a bubble at the top of the container.
2. Background Information
High density electronics, such as, integrated circuits, hybrids circuits, optical-electronics, etc. are increasingly manufactured with thin-film metals, such as gold, aluminum, nickel etc.. When the metals are exposed to ionic contaminants, temperatures and electrical voltage; corrosion causes a degradation in electrical performance. Protection against corrosion is provided by isolating the material against moisture. This is accomplished by applying a protective coating on the electronic circuits such as silicon dioxide, silicon Nitride epoxy and the like. Protection is also provided by positioning the electronic circuit in a moisture resistant container constructed of metal, glass, or a ceramic. These containers are generally assembled from two or more parts sealed by soldering, welding or glass bonding process.
MIL-STD 1014 is one standard for testing/qualifying leakage rates of hermetically sealed microcircuits. In this test containers are allowed to have leak rates up between 1×10
−7
and 5×10
−8
atm-cm/sec (volume dependent). This, however has been shown to allow moisture penetration sufficient to cause failure of the device by corrosion within 1 year. Consequently, even though a device has passed this test, its extended life is unknown.
SUMMARY AND OBJECTS OF THE INVENTION
The present method relates to an improved method of isolating high density electronic circuits from detrimental contaminants comprising the immersion and maintenance of the circuit in a hydrophobic liquid of a package or container to prolong their life cycle. The electronic circuit is mounted on a pedestal to preclude the contamination of the electronic assembly with condensed moisture or air bubble by maintaining its immersion in the fluid.
It is an object of the present invention to provide and disclose an improved method for sealing high density electronic circuits.
It is a further object of the invention to provide and disclose a method for protecting high density electronic circuits from harmful substances which obviates the need for hermetic sealing.
It is a further object of the invention to provide and disclose an improved method for sealing high density electronic circuits sufficient to assure a life cycle equivalent to or better than current hermetic packaging methods.
It is a further object of the invention to provide and disclose an improved method of sealing of a high density circuit comprising the immersion of the circuit in a hydrophobic liquid.
It is a further object of the invention to provide and disclose an improved method for sealing high density electronic circuity comprising the positioning of the circuit on a pedestal to avoid contamination of the electronic circuit due to the ingress of contaminants over time.
It is a further object of the invention to provide and disclose an improved method for sealing high density electronic containers which have not been subjected to a protective process.
It is a further object to provide and disclose an improved method for sealing a high density electronic circuit which has been coated with a protective coating.
The forgoing and other objects and advantages of the invention will appear from the following description. In the description, reference is made to the accompanying drawings, which form a part thereof.
REFERENCES:
patent: 3229023 (1966-10-01), Bolton et al.
patent: 4056681 (1977-11-01), Cook, Jr.
patent: 4786864 (1988-11-01), Beha et al.
patent: 4918511 (1990-04-01), Brown
patent: 4953005 (1990-08-01), Carlson et al.
patent: 2518812 (1981-12-01), None
Clohan, Jr. Paul S.
Kincaid Kristine
Patel Dhiru R
The United States of America as represented by the Secretary of
LandOfFree
System and method for sealing high density electronic circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for sealing high density electronic circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for sealing high density electronic circuits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2484362