Method and apparatus for testing an unpackaged semiconductor die

Details Method and apparatus for testing an unpackaged semiconductor die Method and apparatus for testing an unpackaged semiconductor die

1995-10-30

1998-10-20

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, 324758, G01R 3128

Patent

active

058251952

ABSTRACT:
Optical alignment techniques, such as those used in "flip chip" bonding, are used to establish ohmic contact with the die by means of raised portions on contact members. This permits accurate alignment with a temporary die fixture in order to test the die. The tested die can then be qualified under a known good die program as having an acceptable degree of reliability. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. The ohmic contact is preferably established by applying a compression force to the die using an interconnect insert resulting in a limited penetration of the contact member into the bondpads. The arrangement may be used for establishing electrical contact with a burn-in oven.

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