Power carrier with selective thermal performance

Details Power carrier with selective thermal performance Power carrier with selective thermal performance

1993-01-27

1994-04-19

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257713, 361713, 361764, H05K 720

Patent

active

053051866

ABSTRACT:
A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided. The thermal conduction means includes a first heat dissipation back plate means associated with the power chip and a second heat dissipation back plate means associated with the integrated circuit means. The heat dissipation back plate means are electrically isolated from each other and have different heat dissipation capacity.

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