Pre-matched module for an ultra-high frequency diode and a proce

Details Pre-matched module for an ultra-high frequency diode and a proce Pre-matched module for an ultra-high frequency diode and a proce

1987-04-10

1989-09-05

Wojciechowicz, Edward J.

357 51, 357 79, 357 81, H01L 2348

Patent

active

048643840

ABSTRACT:
The invention provides a process for mounting an ultra-high frequency diode so as to form a pre-matched module.
The module of the invention comprises a copper base, a quartz ring and a copper cover: these three parts, coated with gold at least on their facing faces, are assembled together by thermocompression. Inside this case, the diode chip, soldered to the base via a gold heat sink is biased by a false "beam-lead" connection, a metal star whose arms are curved, which reduces the inductance and capacity of this connection with respect to the base. The false "beam-lead" is formed by metalizing a mesa obtained on a silicon wafer.

REFERENCES:
patent: 3931635 (1976-01-01), Sundstrom
patent: 4415025 (1983-11-01), Horvath
Nachrichten Electronik, vol. 33, No. 4, Apr. 1979, Heidelberg, "Millimeterwellen-Halbleiter und Systeme Teil 2", pp. 118-123.
POEE Journal, vol. 72, No. 4, Jan. 1980, Pilgrim et al, pp. 220-227.

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