Semiconductor device that compensates for package induced delay

Details Semiconductor device that compensates for package induced delay Semiconductor device that compensates for package induced delay

1997-11-07

1999-05-11

Martin-Wallace, Valencia

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257786, H01L23/48;23/52;29/40

Patent

active

059030577

ABSTRACT:
A semiconductor device includes a first and second pin, a first lead finger coupled to the first pin and a second lead finger coupled to the second pin, and a die coupled to the lead fingers. The die includes a first die pad coupled to the first lead finger and a second die pad coupled to the second lead finger. The die further includes a first output driver coupled to the first die pad and a second output driver coupled to the second die pad. The first output driver is coupled to the first die pad via an extended metal trace. The extended metal trace compensates for differences in electrical length between the first lead finger and the second lead finger.

REFERENCES:
patent: 5229846 (1993-07-01), Kozuka
patent: 5394008 (1995-02-01), Ito et al.
patent: 5399904 (1995-03-01), Konzo
patent: 5400218 (1995-03-01), Val
patent: 5646830 (1997-07-01), Nagano

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