Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-11-17
2001-06-05
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C024S458000, C248S510000, C361S719000
Reexamination Certificate
active
06243266
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a locking device for locking a heat sink to a CPU package, and particularly to a locking device for locking a heat sink to CPU packages of a range of thicknesses.
2. Brief Description of the Prior Art
FIG. 7
shows a prior art locking device, a CPU package
1
and a heat sink
2
attached to the CPU package
1
. The prior art locking device comprises a bracket
4
and a plurality of pegs
3
for locking the heat sink
2
to the CPU package
1
. The pegs
3
each have a stanchion
5
with a cap
13
at one end thereof and a head
6
at the other end thereof. Diameters of the heads
6
are slightly larger than those of the stanchions
5
. The bracket
4
includes a flat base
11
and a plurality of longitudinally extending cantilever parts
7
extending from the base
1
. The cantilever parts
7
are curved while engaging surfaces of all ends thereof are coplanar with a mating surface of the base
11
. The curved cantilever parts
7
define a plurality of engaging holes
8
. A plurality of slots
9
respectively extends from the engaging holes
8
oriented in a single direction. Lateral dimensions of the slots
9
are slightly larger than those of the stanchions
5
of the pegs
3
for mating with the stanchions
5
. The engaging holes
8
are slightly larger than the heads
6
for receiving the heads
6
. In assembly, the pegs
3
sequentially penetrate the corresponding subassemblies of the heat sink
2
, the CPU package
1
, and the engaging holes
8
of the bracket
4
. Then, when the bracket
4
is moved slidingly along a bottom surface of the CPU package, the stanchions
5
are moved along the slots
9
and are retained in an end of the slots
9
. Therefore, the pegs
3
are attached to the bracket
4
for securing the heat sink
2
and the CPU package
1
in position. With the development of new production technologies, however, PLGA type and OLGA type CPU packages of different thickness are becoming commonplace. The prior art locking device described above is only adapted for locking CPU packages of a fixed thickness. Hence, an improved locking device is required to overcome the disadvantages of the prior art.
BRIEF SUMMARY OF THE INVENTION
A first object of the present invention is to provide an improved locking device adapted for locking a heat sink to CPU packages of different thicknesses;
A second object of the present invention is to provide an improved locking device adapted for locking a heat sink to CPU packages of different thicknesses which decreases the production cost;
A further object of the present invention is to provide an improved locking device adapted for locking a heat sink to CPU packages of different thicknesses which improves assembly efficiency.
To achieve the above objects, a locking device in accordance with the present invention comprises a plurality of pegs and a bracket used to securely lock a heat sink to CPU packages of a range of thicknesses. The pegs each have a stanchion with a cap at one end and a head at an opposite end, and a neck which is smaller in diameter than the stanchion or the head and which connects the head to the stanchion. The bracket has a flat base with a handle portion downwardly depending therefrom and a plurality of cantilever parts longitudinally extending from corners of the base. The cantilever parts each possess a body portion horizontally extending from the base, two resilient ramps respectively extending from opposite ends of the body portion at different angles, two locking recesses respectively extending from the ramps and slightly protruding toward the base, and sustaining flanges respectively extending from the locking recesses and each forming an engaging surface which is coplanar with a mating surface of the base and the body portions for pressing against the CPU package. Each cantilever part has one ramp extending from the body portion thereof at a larger angle than that of the other ramp so that the corresponding locking recess is spaced a greater vertical distance above the base than the other locking recess. The cantilever parts each define a slot extending from the first locking recess to the second locking recess. The dimensions of the slots are slightly larger than those of the necks of the pegs for engaging with the necks. The body portions each define an engaging hole intersected by the slot. The engaging holes are adapted for receiving the heads of the pegs.
In assembly, the heads of the pegs sequentially penetrate the heat sink, the CPU package, and the engaging holes of the brackets. When the handle portion of the bracket is then moved in a direction, each neck slides along a slot and is retained in an end of the slot in a locking recess. Thereby, the pegs are attached in either of two sets of locking recesses at either of two different heights above the base and so can lock the heat sink to CPU packages of different thicknesses.
In an alternative embodiment, a locking device has a bracket with a plurality of cantilever parts extending in an arc around the base of the bracket. The slots defined in the cantilever parts correspondingly extend in an arc for receiving the necks of the pegs during a rotation of the bracket which securely locks the heat sink to the CPU package.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 5978223 (1999-11-01), Hamilton
patent: 5982622 (1999-11-01), Chiou
patent: 6008990 (1999-12-01), Liu
Chung Wei Te
Foxconn Precision - Components Co., Ltd.
Tolin Gerald
LandOfFree
Locking device for CPU packages of different thicknesses does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Locking device for CPU packages of different thicknesses, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Locking device for CPU packages of different thicknesses will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2471603