Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
1999-04-23
2001-08-28
Atkinson, Christopher (Department: 3743)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104210, C361S700000, C257S715000
Reexamination Certificate
active
06279649
ABSTRACT:
CROSS REFERENCE TO RELATED APPLICATIONS
This application is based on and claims priority of Japanese Patent Application Nos. Hei. 10-117008 filed on Apr. 27, 1998, and Hei. 10-233784 filed on Aug. 20, 1998, the contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a cooling apparatus using boiling and condensing refrigerant, capable of cooling an exothermic body by heat radiation caused by repetitive boiling and condensing refrigerant.
2. Description of Related Art
One type of related cooling apparatus using boiling and condensing refrigerant is disclosed in U.S. patent application Ser. No. 08/790,015.
According to this related art, a heat insulating passage
110
is formed inside a refrigerant tank
100
as shown in FIG.
30
. The heat insulating passage
110
is formed between a vapor passage
120
and a condensed liquid passage
130
to reduce the amount of heat transferred from an exothermic body through the vapor passage
120
to the liquid refrigerant in the condensed liquid passage
130
. Accordingly, boiling of the refrigerant in the condensed liquid passage
130
is prevented, and the condensed liquid refrigerant in the condensed liquid passage
130
sent from a radiator can be stably supplied to the vapor passage
120
.
According to the above related apparatus, however, if the temperature of the exothermic body increases, a part of the bubbles generated in the heat insulating passage
110
may flow back (return) to the vapor passage
120
via a communication passage
140
. Accordingly, the boiling refrigerant surface in the vapor passage
120
may be filled with more bubbles, and the radiation performance of the apparatus may be compromised.
Furthermore, according to the above related apparatus, the refrigerant tank
100
is formed by an extruded material, and an extruded support wall
150
divides the refrigerant tank
100
into the vapor passage
120
and the condensed liquid passage
130
. Further, in order to form the heat insulating passage
110
, an extra support wall
160
is extruded. Thus, the extrusion performance may be compromised because a cross section of the refrigerant tank
100
is asymmetric. If another extra support wall to add an extra heat insulating passage is formed to make the refrigerant tank
100
symmetric, the apparatus may be increased in size by the extra heat insulating passage.
SUMMARY OF THE INVENTION
The present invention is made in light of the foregoing problems, and it is an object of the present invention to provide a cooling apparatus which can improve the radiating performance by reducing the reverse flow of the bubble (vaporized refrigerant) from the heat insulating passage to the vapor passage (refrigerant chamber) via the communication passage.
Another object of the present invention is to provide a cooling apparatus which can prevent the boiling of the refrigerant in the condensed liquid passage without compromising the extrusion performance and without increasing the size of the apparatus.
According to a first aspect of the present invention, a refrigerant tank has a refrigerant chamber in which liquid refrigerant is vaporized by receiving heat transmitted from an exothermic device, a condensed liquid passage in which condensed refrigerant flows, a heat insulating passage provided between the refrigerant chamber and the condensed liquid passage for reducing heat transmission from the refrigerant chamber to the condensed liquid passage, and a communication passage provided at a bottom of the refrigerant tank for communicating the refrigerant chamber, the condensed liquid passage, and the heat insulating passage. A vapor reverse flow reducing member is provided between the heat insulating passage and the communication passage for reducing a flow of the gaseous refrigerant from the heat insulating passage to the communication passage.
Accordingly, the vaporized gaseous refrigerant generated in the heat insulating passage is prevented from entering the refrigerant chamber via the communication passage. Thus, the bubble at a boiling surface in the refrigerant chamber is reduced, and the heat radiation performance is improved.
According to another aspect of the present invention, a refrigerant tank has a refrigerant chamber in which liquid refrigerant is vaporized by receiving heat transmitted from an exothermic device, a condensed liquid passage in which condensed refrigerant flows, and a communication passage provided at a bottom of the refrigerant tank for communicating the refrigerant chamber and the condensed liquid passage. The condensed liquid passage includes a heat insulating passage therein for reducing heat transmission from the refrigerant chamber to the condensed liquid passage.
Accordingly, the boiling of the refrigerant in the condensed liquid passage is prevented without compromising the extrusion performance and without increasing the size of the apparatus.
REFERENCES:
patent: 4949164 (1990-08-01), Ohashi et al.
patent: 5832989 (1998-11-01), Osakabe et al.
patent: 6119767 (2000-09-01), Kadota et al.
patent: 0152150 (1982-09-01), None
patent: 0083184 (1983-05-01), None
patent: 0131755 (1983-08-01), None
patent: 409205167 (1997-08-01), None
Atkinson Christopher
Denso Corporation
Harness Dickey & Pierce PLC
LandOfFree
Cooling apparatus using boiling and condensing refrigerant does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling apparatus using boiling and condensing refrigerant, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling apparatus using boiling and condensing refrigerant will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2466812