Compositions and methods for reduced food adhesion

Details Compositions and methods for reduced food adhesion Compositions and methods for reduced food adhesion

1999-04-15

2001-05-08

Szekely, Peter (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C524S154000, C524S157000, C524S159000, C524S313000, C524S315000, C524S318000, C524S606000, C524S609000, C524S611000, C524S231000, C099S324000, C099S403000, C220S573100, C220S573200, C220S912000

Reexamination Certificate

active

06228915

ABSTRACT:

CROSS-REFERENCE TO RELATED APPLICATIONS
Not applicable.
FEDERALLY SPONSORED RESEARCH
Not applicable.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to compositions and methods for reducing food deposit adhesion to cookware. More specifically this invention relates to a resin composition having a glass transition temperature of at least 180° C. containing an amount of at least one fatty acid ester, fatty acid amide, anionic surfactant, or a mixture containing at least one of the foregoing to reduce food deposit adhesion on cookware made from the composition. The invention also relates to a method for providing plastic cookware having reduced food deposit adhesion.
2. Brief Description of the Related Art
Plastic cookware has gained increased acceptance and use in recent years due in part to their relatively low cost, durability with light weight, and flexibility in design. Unfortunately, adhesion of food deposits and the accompanying stains as observed with more traditional metal cookware is also obtained with plastic cookware. Non-stick cookware has been developed as a solution to adhesion of food deposits to reduce sticking and ease cleaning.
Methods to prepare non-stick cookware generally involve application of a surface treatment or lamination of a thin non-stick layer to the surface of the cookware. These methods are expensive and reduce the cycle time of the manufacturing process. What is needed in the art is a method for reducing the adhesion of food deposits on plastic cookware without secondary steps.
SUMMARY OF THE INVENTION
The method of the present invention to reduce adhesion of food deposits on cookware comprises a resin with a glass transition temperature of at least 180° C. and an amount of at least one additive selected from fatty acid esters, fatty acid amide, anionic surfactant, or a mixture containing at least one of the foregoing effective to reduce food deposit adhesion on cookware made from the composition. The invention also includes the compositions and articles made from the compositions having reduced adhesion of food deposits. Various features and advantages of the present invention will be appreciated and understood by those skilled in the art from the following detailed description.
DETAILED DESCRIPTION OF THE INVENTION
According to this invention, there is a method provided to reduce adhesion to food deposit on cookware made from at least one resin having a glass transition temperature of at least 180° C. The need for the high glass transition temperature is to allow for the high temperatures common during food preparation. Accordingly, the resins have to have sufficient heat resistance to resist deformation during use. Suitable resins include polycarbonates, polyimides, polyamides, polyamideimides, polysulfones, polyethersulfones, polyarylsulfones, polyphenylsulfones, polyetherketones, aromatic copolyesters, and polyetherimides as well as various blends containing at least one of the foregoing resins. These resins are generally known in the art as are methods for the preparation.
In one embodiment, the resin is a polyetherimide resin comprising structural units of the formula (I):
wherein the divalent T moiety bridges the 3,3′, 3,4′, 4,3′, or 4,4′ positions of the aryl rings of the respective aryl imide moieties of formula (I); T is —O—or a group of the formula —O—Z—O—; Z is a divalent radical selected from the group consisting of formulae (II):
wherein X is a member selected from the group consisting of divalent radicals of the formulae (III):
wherein y is an integer from 1 to about 5, and q is 0 or 1; R is a divalent organic radical selected from the group consisting of: (a) aromatic hydrocarbon radicals having from 6 to about 20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals having from 2 to about 20 carbon atoms, (c) cycloalkylene radicals having from 3 to about 20 carbon atoms, and (d) divalent radicals of the general formula (IV):
where Q is a member selected from the group consisting of formulae (V):
where y′ is an integer from about 1 to about 5. A particularly preferred polyetherimide resin is the reaction product formed by melt polymerization of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride with one or more of paraphenylene diamine and metaphenylene diamine. The resins are commercially available from GE Plastics under the mark ULTEM resins.
Other particularly useful resin include polysulfones of the formulae (VI), (VI), (VIII), (IX), and (X):
These materials are commercially available from BASF, Amoco, and ICI under a variety of tradenames.
A second key component of the present invention is an amount of at least one fatty acid ester, fatty acid amide, anionic surfactant, or a mixture containing at least one of the foregoing effective to reduce food deposit adhesion on articles and cookware made from the composition.
The fatty acid esters and fatty acid amides of this invention are derivatives of saturated and unsaturated normal fatty acids having from about fourteen to about thirty-six carbon atoms, inclusive. Representative fatty acids are, for example, tetradecanoic, pentadecanoic, hexadecanoic, heptadecanoic, octadecanoic, nonadecanoic, eicosanoic, henecosanoic, decosanoic, tricosanoic, tetracosanoic, pentacosanoic, hexacosanoic, triacontanoic, hentriacontanoic, dotriacontanoic, tetratriacontanoic, pentatriacontanoic, hexatriacontanoic acids, myristic, palmitic, stearic, arachidic, behenic and hexatrieisocontanoic (C
36
) acids, palmitoleic, oleic, linolenic and cetoleic, and the like.
The methods of preparation of fatty acid esters and fatty acid amides employed are generally known in the art. For example, fatty acid esters are commonly prepared by the reaction of an alcohol and a fatty acid or a fatty acid derivative, such as a fatty acid halide. Polyols are also useful to prepare fatty acid polyesters as are the corresponding polyamines to prepare fatty acid polyamides. Representative polyols are ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol 1,6-hexanediol, a polyglycol such as diethylene glycol, triethylene glycol, dipropylene glycol, dibutylene glycol, trimethylene glycol, isobutylene-ethylene glycol, trimethylene glycol; the monoethyl, monopropyl or monobutyl ethers of glycerol, dicyclopentadienyl dimethanol, pentaerythritol, dipentaerythritol, tripentaerythritol, trimethylolpropane, trimethylolethane, etc., glycerol, glycerol mono-acetate, mannitol, sorbitol, xylose, and the like, or mixtures thereof.
In one embodiment of the invention, fatty amides are preferred as the food releasing additive. Included as additives are saturated fatty acid monoamide (preferably, lauramide, palmitamide, arachidamide behenamide, stearamide, 12 hydroxy stearamide); unsaturated fatty acid monoamide (preferably, oleamide, erucamide, recinoleamide); and N-substituted fatty acid amide (more preferably, N-stearyl stearamide, N-behenyl behenamide, N-stearyl behenamide, N-behenyl stearamide, N-oleyl oleamide, N-oleyl stearamide, N-stearyl oleamide, N- stearyl erucamide, erucyl erucamide, and erucyl stearamide, N-oleyl palmitamide, methylol amide (more preferably, methylol stearamide, methylol behenamide); saturated fatty acid bis-amide (more preferably, methylene bis-stearamide, ethylene bis-stearamide, ethylene bis-isostearamide, ethylene bis-hydroxystearamide, ethylene bis-behenamide, hexamethylene bis-stearamide, hexamethylene bis-behenamide, hexamethylene bis-hydroxystearamide, N,N′-distearyl adipamide, N,N′-distearyl sebacamide); unsaturated fatty acid bis-amide (more preferably, ethylene bis-oleamide, hexamethylene bis-oleamide, N,N′-dioleyl adipamide, N,N′-dioleyl sebacamide; saturated or unsaturated fatty acid tetra amide, stearyl erucamide, ethylene bis stearamide and ethylene bis oleamide.
A large number of useful fatty amides are commercially available from Humko Chemical Company, Memphis, Tenn. under the Kemamide tradename and include, for example, Kemamide B (behenamide/arachidamide),

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