Method of separating electronic elements

Details Method of separating electronic elements Method of separating electronic elements

1996-10-03

1998-10-20

Niebling, John

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438458, 438459, 438460, 438462, 438977, H01L 21301, H01L 2146, H01L 2178

Patent

active

058245952

ABSTRACT:
A method for separating elements associated within a body includes creating a separation region within the body, between the elements, leaving a region of the body which is to be thinned. The method then requires depositing a delay layer on the body, with an opening around the separation region. The delay layer has a predetermined removal rate relative to the removal rate of the body. Lastly, the method requires removing a predetermined amount of the delay layer, the separation region, and the region of the body to be thinned. Preferably, the removing is accomplished by etching, such as plasma etching, and the etch rate of the delay layer is lower than the etch rate for the separation region. In a preferred method, the predetermined removal rate and the positions of the openings in the delay layer are selected so that upon after etching, the elements remaining have a predetermined locus dependent thickness. Alternatively, the delay layers may be formed from the base material, formed from a metallic material or made from a silicon dioxide (SiO.sub.2) material. The base material is preferably a semiconductor wafer and the elements are semiconductor based electronic elements.

REFERENCES:
patent: 4236296 (1980-12-01), Woolhouse et al.
patent: 4418472 (1983-12-01), Lorenzo, Jr.
patent: 5196378 (1993-03-01), Bean et al.
patent: 5418190 (1995-05-01), Cholewa et al.
Shumate et al., Silicon Wafer Thinning and Dicing Round or Non Orthogonal Die Using Dry Etching, Motorola Technical Developments, vol. 23, p. 8, Oct. 1994.
European Search Report Feb. 14, 1997.

Affiliated with

Also associated with

Rating

Method of separating electronic elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of separating electronic elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of separating electronic elements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-243879