Fishing – trapping – and vermin destroying
Patent
1987-11-13
1989-09-05
Hearn, Brian E.
Fishing, trapping, and vermin destroying
148DIG65, 148DIG84, 148DIG72, 148DIG149, 437 26, 437 82, 437126, 437108, 437132, 437 80, 437973, 156603, 156610, H01L 21263, H01L 21225
Patent
active
048638773
ABSTRACT:
A method for reducing the defect and dislocation density in III-V material layers deposited on dissimilar substrates is disclosed. The method involves ion implantation of dopant materials to create amorphous regions within the layers followed by an annealing step during which the amorphous regions are recrystallized to form substantially monocrystalline regions. The wafers produced by the process are particularly well suited for optoelectronic devices.
REFERENCES:
patent: 4174982 (1979-11-01), Immorlica, Jr.
patent: 4177084 (1979-07-01), Lau et al.
patent: 4193182 (1980-03-01), Lee
patent: 4312681 (1982-01-01), Rupprecht et al.
patent: 4333226 (1982-06-01), Abe et al.
patent: 4377437 (1983-03-01), Taylor et al.
patent: 4391651 (1983-07-01), Yoder
patent: 4396437 (1983-08-01), Kwok et al.
patent: 4494997 (1985-01-01), Lemnios et al.
patent: 4509990 (1985-04-01), Vasudev
patent: 4544417 (1985-10-01), Clarke et al.
patent: 4558509 (1985-12-01), Tiwari
patent: 4569124 (1986-02-01), Rensch et al.
patent: 4588447 (1986-11-01), Golecki
patent: 4602965 (1986-07-01), McNally
patent: 4659392 (1987-03-01), Vasudev
patent: 4713354 (1987-12-01), Egawa et al.
Howes et al., Gallium Arsenide Materials, Devices, and Circuits, John Wiley & Sons, New York, NY, 1985, pp. 163-166.
Sze, VLSI Technology, McGraw-Hill Book Co., New York, NY, 1983, pp. 220-224.
Turner et al., "High-Speed Photoconductive Detectors Fabricated in Heteroepitaxial GaAs Layers", Mat. Res. Soc. Symp. Proc., vol. 67, 1986, pp. 181-188.
Wolf et al., Silicon Processing for the VLSI Era, Lattice Press, Sunset Beach, California, 1986, pp. 305-308.
Lau et al., Appl. Phys. Lett., 34(1):76-78 (Jan. 1, 1979).
Fan John C. C.
Lee Jhang W.
Narayan Jagdish
Bunch William
Hearn Brian E.
Kopin Corporation
LandOfFree
Ion implantation and annealing of compound semiconductor layers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ion implantation and annealing of compound semiconductor layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ion implantation and annealing of compound semiconductor layers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-243313