Equipment for continuous plating

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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Details

204224R, 204237, 204277, C25D 1700, C25D 1706, C25D 2110

Patent

active

042797306

ABSTRACT:
Device for selective electrodeposition of metal flat stock, on laddered or bandoliered component strips having at least one station filled with electrolyte through which the component strips are transported lengthwise. The device includes a longitudinal guide means for the component strips-the guide means is provided with a slot shaped chamber. The chamber, at its lower side is in open contact with a plating bath filled with electrolyte on a level lower than the electrolyte level in the plating bath. The guide means has apertures for introducing pressurized gas or air. The plating bath contains tubes with holes in such a position that during operation electrolyte recirculated through a transport pump can be jetted onto the portion of the metal or component strip which extends below the slot-shaped chamber of the guide means into the electrolyte.

REFERENCES:
patent: 3643670 (1972-02-01), Sabatka et al.
patent: 4029555 (1977-06-01), Tezuka et al.
patent: 4032414 (1977-06-01), Helder et al.
patent: 4035245 (1977-07-01), Danneels et al.
patent: 4038169 (1977-07-01), Lovejoy et al.
patent: 4069125 (1978-01-01), Marek et al.
patent: 4072581 (1978-02-01), Allen
patent: 4155815 (1979-05-01), Francis et al.
patent: 4163704 (1979-08-01), Murata
patent: 4186062 (1980-01-01), Eidschun

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