Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1984-01-25
1985-10-15
Czaja, Donald
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
2642711, 264275, 264277, B29H 900
Patent
active
045473307
ABSTRACT:
A method is disclosed for preparing orifice plates for ink jet printing apparatus from a set of orificed cylindrical jewels having substantially identical fluid flow rates therethrough. Several pairs of closely spaced thin wires are mounted transversely across a mold cavity. Each pair of wires is tensioned to support a cylindrical jewel without deflection. Two backing plates then are placed on the mold to position the jewels in precise alignment. The mold then is filled with a liquid resin to cover the jewels. The resin then is cured to a solid state. The cured structure is removed from the mold and the protruding wires are trimmed to form the finished orifice plate.
REFERENCES:
patent: 2577584 (1951-12-01), Hofreiter
patent: 2996419 (1961-08-01), Schmick
patent: 3156950 (1964-11-01), Walton, Jr.
patent: 3294504 (1966-12-01), Hicks, Jr.
patent: 3737367 (1973-06-01), Roberts et al.
patent: 3754882 (1973-08-01), Van Esdonk et al.
patent: 4166564 (1979-09-01), Wolber
Humenik, Seal Glass for Ink Jet Nozzle Arrays vol. 20, No. 9, 2/78.
Czaja Donald
Fischbach V.
The Mead Corporation
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