High density interconnect thermoplastic die attach material and

Details High density interconnect thermoplastic die attach material and High density interconnect thermoplastic die attach material and

1993-02-22

1994-09-20

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156280, 156281, 156299, 156305, 1563309, 156344, 437209, 437211, B32B 3100

Patent

active

053486072

ABSTRACT:
A mixture for affixing dice to a substrate includes a thermoplastic polyimide, a solvent for the polyimide, and a solvent which does not dissolve the polyimide but adds thixotropicity to the mixture. The mixture is applied to the substrate, the dice are placed thereon, and the solvents are evaporated to bond the dice to the substrate. The bond is radiation hard and exhibits high shear pull strength. A poor solvent for the polyimide, sprayed over the dice and exposed portions of die attach material, causes some polyimide to precipitate out of solution in the exposed portions of die attach material to form a grid that extends between the dice and prevents the dice from "swimming together" during high temperature processing. In a solvent die-attachment method, the substrate is first coated with a mixture of die attach material, and the mixture is dried. Spraying a solvent over the die attach material causes the material to soften so that the dice applied thereto may adhere. The die attach material is then dried to form the bond.

REFERENCES:
patent: 3541036 (1970-11-01), Libackyj
patent: 3759913 (1973-09-01), Blackley
patent: 4184133 (1980-01-01), Gehle
patent: 4918811 (1990-04-01), Eichelberger et al.

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