Polyarylene sulfide and a composition thereof

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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528373, 528388, 528486, 528488, 528489, 528492, 528499, 528502A, C08G 7502, C08K 554, C08L 8102

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059454903

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

The present invention relates to polyarylene sulfide and a process for the preparation thereof. The present invention also relates to a composition comprising the polyarylene sulfide and a molded article thereof.


PRIOR ART

There has been a need for a thermoplastic resin which has high heat resistance and chemical resistance as a material for electric and electronic parts, automobile parts or chemical apparatus parts. Recently, polyarylene sulfide (hereinafter referred to as PAS), typically polyphenylene sulfide (hereinafter referred to as PPS), has drawn attention as one of resins which meet such a need.
A process for the preparation of PAS is described in Japanese Patent Publication No. Sho-45-3368/1970, in which an alkali metal sulfide is reacted with a dihaloaromatic compound in an organic amide solvent. However, this process cannot give PAS having a high molecular weight.
Accordingly, PAS having a low molecular weight as mentioned above is subjected to heat acidifying treatment for cross-linking to obtain PAS having a high molecular weight. However, the cross-linked PAS thus obtained is inferior in mechanical strength such as impact strength. In addition, such PAS has also a drawback of being inferior in processability. Several methods have been proposed in order to improve the mechanical strength such as impact resistance.
In Japanese Patent Publication No. Sho-52-12240/1977, the polymerization is conducted in the presence of metal carboxylates such as sodium acetate and lithium acetate in order to prepare high molecular PAS. However, the above compounds are expensive. Moreover, large equipments, technology and costs are needed for separating and recovering the above compounds. This method is thus extremely disadvantageous. In addition, as the PAS obtained did not have enough reactivity with an epoxy type silane coupling agent, it was impossible to sufficiently enhance mechanical strength such as impact strength by adding the epoxy type silane coupling agent.
In Japanese Patent Publication No. Hei-6-39113/1994, there is disclosed a composition comprising PAS, a silane compound such as epoxyalkoxy silane and an inorganic filler. However, the reactivity of PAS with the silane compound is not enough to improve its mechanical strength such as impact strength.
In Japanese Patent Application Laid-open No. Hei-6-256517/1994, there is disclosed PAS which has a particular melt flow rate and shows a particular degree of increase in melt viscosity after 1% of gamma-glycidoxypropyltrimethoxysilane is added. However, it is necessary to add an alkali metal hydroxide to a reaction system in the preparation of the PAS. Accordingly, the above process is very disadvantageous for an industrial scale of the preparation of PAS because of its higher costs. Moreover, large equipments, technology and costs are needed for separating and recovering the above compound. This is another large disadvantage.
Meanwhile, PAS is relatively poor in adhesion to other resins, particularly epoxy resins. Accordingly, there has been a problem of poor adhesion property of PAS when PAS is bonded to PAS or to other resins with an epoxy type adhesive or when electric or electronic parts are sealed with an epoxy resin.
Accordingly, various attempts have been done in order to improve adhesion of PAS to epoxy resins. For example, there are disclosed a PPS resin composition comprising a carnauba wax in Japanese Patent Application Laid-open No. Hei-2-272063/1990; a PPS resin composition in which a fibrous and/or nonfibrous filler and polyalkylene ether are blended in Japanese Patent Application Laid-open No. Hei-4-275368/1992; a PPS resin composition comprising a highly water absorbing resin such as a cross-linked polyacrylic acid salt in Japanese Patent Application Laid-open No. Hei-5-171041/1993; a PPS resin composition in which an aromatic sulfone compound and a fibrous and/or nonfibrous filler are blended in Japanese Patent Application Laid-open No. Hei-6-57136/1994; a PPS resin composition in which an aliphatic polyes

REFERENCES:
patent: 3354129 (1967-11-01), Edmonds et al.
patent: 3562199 (1971-02-01), Hill, Jr. et al.
patent: 4016145 (1977-04-01), Campbell
patent: 5342920 (1994-08-01), Imai et al.

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