Substrate carrier having a streamlined shape and method for thin

Coating apparatus – Gas or vapor deposition – Work support

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118715, 118125, 118500, C23C 1600

Patent

active

059449047

ABSTRACT:
A structure for chemical vapor deposition processing includes a substrate carrier (10) having a streamlined shape. When placed in a mainstream flow (21), the substrate carrier (10) maintains a laminar boundary layer over a substrate (17) under high gas flow rate conditions. In a further embodiment, the substrate carrier (10) includes a device (27) for directly injecting a reactant gas stream (33) into the boundary layer.

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