Electrodeposition apparatus

Details Electrodeposition apparatus Electrodeposition apparatus

1990-12-04

1992-05-12

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204279, 204295, C25C 110, C25C 700, C25C 704, C25D 2104

Patent

active

051124653

ABSTRACT:
A contamination control apparatus for sealable interconnection with plating tanks of the character used in the electrodeposition of an electrodeposit onto a substrate which is uniquely designed so as to permit the free escape of hydrogen, but to block the escape of most metal atoms released from the plating solution and to return them to the solution by force of gravity thereby eliminating the need for complex ventilating and fume scrubbing systems.

REFERENCES:
patent: 1085742 (1914-02-01), Leffel
patent: 1838666 (1931-12-01), Fink et al.
patent: 2439491 (1948-04-01), Schiffl
patent: 2465747 (1949-03-01), Pessel
patent: 4592819 (1986-06-01), Suzuki et al.

Affiliated with

Also associated with

Rating

Electrodeposition apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrodeposition apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrodeposition apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2425324