Universal leadframe carrier

Special receptacle or package – For a building component – Shingle

Patent

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Details

B65D 7302

Patent

active

051119358

ABSTRACT:
A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

REFERENCES:
patent: Re30604 (1981-05-01), Kowalski
patent: 3385426 (1968-05-01), May et al.
patent: 3407925 (1968-10-01), Ruehlemann
patent: 3469684 (1969-09-01), Keady et al.
patent: 3550766 (1970-12-01), Nixen
patent: 3571920 (1971-03-01), Berg
patent: 3868759 (1975-03-01), Hartleroad et al.
patent: 4386463 (1983-06-01), McLaughlin
patent: 4627533 (1986-12-01), Pollard
patent: 4661886 (1987-04-01), Nelson et al.
patent: 4692790 (1987-09-01), Oyamada
patent: 4815595 (1989-03-01), Bond et al.

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